Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits von Goldstein, R V, Sarychev, ME, Shirabaikin, D B, Vladimirov, A S, Zhitnikov, YuV

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CHIMERA: A software tool for reaction rate calculations and kinetics and thermodynamics analysis von Novoselov, Konstantin P., Shirabaikin, Denis B., Umanskii, Stanislav Ya, Vladimirov, Alexander S., Minushev, Airat Kh, Korkin, Anatoli A.

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Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits: Fracture Processes in Microelectronics von GOLDSTEIN, R. V, SARYCHEV, M. E, SHIRABAIKIN, D. B, VLADIMIROV, A. S, ZHITNIKOV, Yu. V

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