Reliability evaluation of a CoWoS-enabled 3D IC package von Banijamali, Bahareh, Chien-Chia Chiu, Cheng-Chieh Hsieh, Tsung-Shu Lin, Hu, Clark, Shang-Yun Hou, Ramalingam, Suresh, Shin-Puu Jeng, Madden, Liam, Yu, Doug C. H.

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High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration von Liu, C. C., Shuo-Mao Chen, Feng-Wei Kuo, Huan-Neng Chen, En-Hsiang Yeh, Cheng-Chieh Hsieh, Li-Hsien Huang, Ming-Yen Chiu, Yeh, J., Tsung-Shu Lin, Tzu-Jin Yeh, Shang-Yun Hou, Jui-Pin Hung, Jing-Cheng Lin, Chewn-Pu Jou, Chuei-Tang Wang, Shin-Puu Jeng, Yu, D. C. H.

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The impact of scaling on metal thickness for advanced back end of line interconnects von Chen, Hsueh-Chung, Fan, Su-Chen, Lin, Jian-Hong, Cheng, Yi-Lung, Jeng, Shin-Puu, Wu, Chii-Ming

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Interference between 3D → 3D electron-exchange transitions and interband excitations in MnO(100) von Jeng, Shin-Puu, Henrich, Victor E.

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Surface passivation of Ni/Cr alloy at room temperature von Jeng, Shin-Puu, Holloway, Paul H., Batich, Chris D.

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Chip-packaging interaction in Cu/very low-k interconnect von Hsiu-Ping Wei, Hao-Yi Tsai, Yu-Wen Liu, Hsien-Wei Chen, Shin-Puu Jeng, Yu, D.C.H.

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Cation-ligand hybridization for stoichiometric and reduced TiO2(110) surfaces determined by resonant photoemission von ZHAOMING ZHANG, SHIN-PUU JENG, HENRICH, V. E

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Satellite structure in the photoemission spectra of MnO(100) von SHIN-PUU JENG, LAD, R. J, HENRICH, V. E

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A self-aligned airgap interconnect scheme von Hsien-Wei Chen, Shin-Puu Jeng, Hao-Yi Tsai, Yu-Wen Liu, Hsiu-Ping Wei, Yu, D.C.H., Sun, Y.C.

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Polymers for high-performance interconnects von Taylor, Kelly J., Jeng, Shin-Puu, Eissa, Mona, Gaynor, Justin, Nguyen, Hoan

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Direct observation of defect-induced surface covalency in ionic CoO (1 0 0) von Jeng, Shin-Puu, Henrich, Victor E.

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Changes induced at Ni/Cr alloy surfaces by annealing and oxygen exposure von Jeng, Shin-Puu, Holloway, Paul H., Asbury, Douglas A., Hoflund, Gar B.

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BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME von Lin, Po-Yao, Jeng, Shin-Puu

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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE von Chen, Hsien-Wei, Jeng, Shin-Puu

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Bump joint structure with distortion and method forming same von Lin, Po-Yao, Jeng, Shin-Puu

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Semiconductor devices and methods of manufacture von Chen, Hsien-Wei, Jeng, Shin-Puu

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Preferential sputtering of Ni/Cr(110) von Jeng, Shin-Puu, Holloway, Paul H.

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A Self-Aligned Air Gap Interconnect Process von Chen, Hsien-Wei, Jeng, Shin-Puu, Tsai, Hao-Yi, Liu, Yu-Wen, Yu, CH, Sun, YC

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SEMICONDUCTOR PACKAGE AND METHOD MANUFACTURING THE SAME von Hsu, Feng-Cheng, Jeng, Shin-Puu

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RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHODS FOR FORMING THE SAME von JUANG, Jing-Ye, CHEN, Hsien-Wei, JENG, Shin-Puu

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