Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints von Jeon, Yu-Jae, Kang, Min-Soo, Shin, Young-Eui

Volltext

Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test von Kang, Min-Soo, Jeon, Yu-Jae, Kim, Do-Seok, Shin, Young-Eui

Volltext

Bonding Strengths and Thermal Degradation of Photovoltaic Module Ribbon Solder Joints von Kang, Min-Soo, Jeon, Yu-Jae, Shin, Young-Eui

Volltext

Investigation of Roughness Correlation in Polymer Brushes via X-ray Scattering von Hildebrandt, Marcus, Shin, Eui-young, Yang, Suan, Ali, Wael, Altinpinar, Sedakat, Gutmann, Jochen S.

Volltext

Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate von Kang, Min-Soo, Kim, Do-Seok, Shin, Young-Eui

Volltext

The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints von Kang, Min-Soo, Kim, Do-Seok, Shin, Young-Eui

Volltext

Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs) von Yim, Byung-Seung, Shin, Young-Eui, Kim, Jong-Min

Volltext

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers von Yim, Byung-Seung, Shin, Young-Eui, Kim, Jong-Min

Volltext

Degradation characteristics and Ni3Sn4 IMC growth by a thermal shock test in SAC305 solder joints of MLCCs applied in automotive electronics von Kang, Min-Soo, Jeon, Yu-Jae, Kim, Do-Seok, Shin, Young-Eui

Volltext

An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler von Yim, Byung-Seung, Lee, Jeong Il, Lee, Byung Hun, Shin, Young-Eui, Kim, Jong-Min

Volltext

Evaluation of the characteristics of 305SAC lead-free solder joints between a chip electrode and a Cu-pad in automotive electronics von Kang, Min-Soo, Jeon, Yu-Jea, Kim, Do-Seok, Shin, Young-Eui

Volltext

Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics von Jo, Jung-Lae, Lee, Jong-Bum, Lee, Jong-Gun, Jeon, Sung-Ho, Kim, Jong-Min, Shin, Young-Eui, Moon, Jeong-Hoon, Yoo, Choong-Don, Jung, Seung-Boo

Volltext

Study of characteristics of solar cells through thermal shock and high-temperature and high-humidity testing von Jeon, Yu-Jae, Kim, Do-Seok, Shin, Young-Eui

Volltext

Holographic polymer-dispersed liquid crystal fabrication under electric field von Shin, Eui Young, Jung, Ju Ai, Hee Kim, Eun, Kim, Byung Kyu

Volltext

Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test von Cho, Ilje, Ahn, Jee-Hyuk, Yoon, Jeong-Won, Shin, Young-Eui, Jung, Seung-Boo

Volltext

The Influences of Residual Stress on the Frequency of Ultrasonic Transducers with Composite Membrane Structure von LEE, Seungmock, KIM, Jong-Min, SHIN, Young-Eui

Volltext

Impact of phosphonate and phosphoramidate in Si/P/triazine hybrid flame retardants on cotton flammability von Shabani, Valbone, Ali, Wael, Assfour, Bassem, Otto, Raphael, Killa, Dennis, Caglar, Seden, Feng, Ying, Shin, Eui-young, Gutmann, Jochen S., Mayer-Gall, Thomas

Volltext

A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials von Shin, Young-Eui, Lee, Jun Hwan, Koh, Young-Wook, Lee, Chong-Won, Yun, Jun Ho, Jung, Seung-Boo

Volltext

The behavior of welded joint in steel pipe members under monotonic and cyclic loading von Chang, Kyong-Ho, Jang, Gab-Chul, Shin, Young-Eui, Han, Jung-Guen, Kim, Jong-Min

Volltext

Stress influences on the ultrasonic transducers von Lee, Seungmock, Tanaka, Tsunehisa, Inoue, Koji, Kim, Jong-Min, Shin, Young-Eui, Okuyama, Masanori

Volltext