Slope stability analysis using the limit equilibrium method and two finite element methods von Liu, S.Y., Shao, L.T., Li, H.J.

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Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads von Shao, T. L., Chen, Y. H., Chiu, S. H., Chen, Chih

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Thermal gradient in solder joints under electrical-current stressing von SHAO, T. L, CHIU, S. H, CHIH CHEN, YAO, D. J, HSU, C. Y

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Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow von Shao, T.L., Chen, T.S., Huang, Y.M., Chen, Chih

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Effect of reinforced particle volume fraction on the failure behavior of TiC/AZ91 composites von Shao, L T, Yao, J P, Hu, Q Y, Huang, K X, Sun, Z

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Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization von SHAD, T. L, LIN, K. C, CHIH CHEN

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Microstructural Evolution During Electromigration in Eutectic SnAg Solder Bumps von Chen, Y.H., Shao, T.L., Liu, P.C., Chen, Chih, Chou, T.

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Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration von Chiu, S. H., Shao, T. L., Chen, Chih, Yao, D. J., Hsu, C. Y.

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Microstructure evolution during electromigration in eutectic SnPb solder bumps von Lu, C.M., Shao, T.L., Yang, C.J., Chen, Chih

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Three-dimensional simulation on current-density distribution in flip-chip solder joints under electric current stressing von Shao, T. L., Liang, S. W., Lin, T. C., Chen, Chih

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Relieving the current crowding effect in flip-chip solder joints during current stressing von Liang, S.W., Shao, T.L., Chen, Chih, Yeh, Everett C.C., Tu, K.N.

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On determination method of thermal conductivity of soil solid material von Chen, Z.X., Guo, X.X., Shao, L.T., Li, S.Q.

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Recognition of the Stress-Strain Curve Based on the Local Deformation Measurement of Soil Specimens in the Triaxial Test von Shao, L. T., Liu, G., Zeng, F. T., Guo, X. X.

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A Novel Open-Loop Tracking Strategy for Photovoltaic Systems von Alexandru, Cătălin

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Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization von HSU, Ying-Chao, SHAO, Tung-Liang, YANG, Ching-Jung, CHIH CHEN

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Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration von Liang, S. W., Chang, Y. W., Shao, T. L., Chen, Chih, Tu, K. N.

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Microscopy and mineralogy of airborne particles collected during severe dust storm episodes in Beijing, China von Shi, Zongbo, Shao, Longyi, Jones, T. P., Lu, Senlin

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Effect of three-dimensional current and temperature distributionson void formation and propagation in flip-chip solder jointsduring electromigration von Liang, S. W., Chang, Y. W., Shao, T. L., Chen, Chih, Tu, K. N.

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Mass Displacement Networks von Neverova, N, Kokkinos, I

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Progress in Improvement and Development of Geomechanics and Engineering Test Equipments von Shao, L-T, Zhu, Y-F, Guo, X-X, Sang, Y, Liu, X, Huang, C, Hua, C-B, Feng, Z-S

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