High-Speed Thermal Imaging Can Resolve Short RF Pulse Effects in Tissue Models von van der Weide, Daniel W., Kendig, Dustin, Shakouri, Mo

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Dual Mode Split Ring Resonator Sensing and Hyperthermia Array for Skin von Gu, Yuchen, Kendig, Dustin, Shakouri, Mo, van der Weide, Daniel W.

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Assessing the Worldwide Potential for WiMAX von Shakouri, Mo

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Power Blurring: Fast Static and Transient Thermal Analysis Method for Packaged Integrated Circuits and Power Devices von Ziabari, Amirkoushyar, Je-Hyoung Park, Ardestani, Ehsan K., Renau, Jose, Sung-Mo Kang, Shakouri, Ali

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Lithium-compatible and air-stable vacancy-rich Li9N2Cl3 for high-areal capacity, long-cycling all-solid-state lithium metal batteries von Li, Weihan, Li, Minsi, Chien, Po-Hsiu, Wang, Shuo, Yu, Chuang, King, Graham, Hu, Yongfeng, Xiao, Qunfeng, Shakouri, Mohsen, Feng, Renfei, Fu, Bolin, Abdolvand, Hamidreza, Fraser, Adam, Li, Ruying, Huang, Yining, Liu, Jue, Mo, Yifei, Sham, Tsun-Kong, Sun, Xueliang

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Lithium-compatible and air-stable vacancy-rich Li 9 N 2 Cl 3 for high–areal capacity, long-cycling all–solid-state lithium metal batteries von Li, Weihan, Li, Minsi, Chien, Po-Hsiu, Wang, Shuo, Yu, Chuang, King, Graham, Hu, Yongfeng, Xiao, Qunfeng, Shakouri, Mohsen, Feng, Renfei, Fu, Bolin, Abdolvand, Hamidreza, Fraser, Adam, Li, Ruying, Huang, Yining, Liu, Jue, Mo, Yifei, Sham, Tsun-Kong, Sun, Xueliang

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Scanning the Special Issue on On-Chip Thermal Engineering von Shakouri, Ali, Kang, Sung-Mo, Bar-Cohen, Avram, Courtois, Bernard

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On-chip thermal engineering von SHAKOURI, Ali, KANG, Sung-Mo, BAR-COHEN, Avram, COURTOIS, Bernard

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Fast Computation of Temperature Profiles of VLSI ICs with High Spatial Resolution von Je-Hyoung Park, Xi Wang, Shakouri, A., Sung-Mo Kang

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Experimental validation of the power blurring method von Je-Hyoung Park, Sangho Shin, Christofferson, James, Shakouri, Ali, Sung-Mo Kang

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Fast Evaluation Method for Transient Hot Spots in VLSI ICs in Packages von Je-Hyoung Park, Shakouri, A., Sung-Mo Kang

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Method of images for the fast calculation of temperature distributions in packaged VLSI chips von Heriz, V.M., Je-Hyoung Park, Kemper, T., Sung-Mo Kang, Shakouri, A.

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