Characteristics of Nanophase WC and WC-3 wt% (Ni, Co, and Fe) Alloys Using a Rapid Sintering Process for the Application of Friction Stir Processing Tools von Jung, Seungboo, Kim, Yongil, Choi, Young, Kim, Daeup

Volltext

Si Characterization on Thinning and Singulation Processes for 2.5/3D HBM Package Integration von Choi, MiKyeong, Kim, SeaHwan, Noh, TaeJoon, Kang, DongGil, Jung, SeungBoo

Volltext

A Scalable Model of Board to FPC Interconnect Using Neural Networks von Hoon Hwangbo, Jongmin Kim, Minkyu Shim, Jongsung Lee, Hyungseok Lee, Byongsu Seol, Seungboo Jung, Wansoo Nah

Volltext

Behaviour of electrochemical migration with solder alloys on printed circuit boards PCBs von Noh, BoIn, Jung, SeungBoo

Volltext

A Study on Adhesive Properties of a Damascene Electroplated Cu Composite Sheet von Shin, Je Sik, Jung, Seung Boo, Moon, Hyung Kwon

Volltext

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE von Jung, Seungboo, Min, Kyungdeuk, Jeong, Haksan, Lee, Hyekyoung, Kang, Donggil, Oh, Namyong, Kang, Taegyu, Hwang, Jaeseon, Ha, Eun

Volltext bestellen

FORMING METHOD OF SOLDER BUMP von JUNG SEUNGBOO, KYUNG DEUK MIN, EUN HA

Volltext bestellen

METHOD FOR FORMING SOLDER BUMPS von JUNG, Seungboo, HA, Eun, MIN, Kyung Deuk

Volltext bestellen

METHOD FOR FORMING REDISTRIBUTION LAYER USING PHOTO-SINTERING von MIN, KyungDeuk, JUNG, SeungBoo, PARK, BumGeun, JUNG, KwangHo, JEONG, HakSan, LEE, ChoongJae, MYUNG, WooRam

Volltext bestellen

Method for electrical connection of Battery cells von MIN KYUNG DEUK, JUNG SEUNGBOO, KIM KYUNG YEAL

Volltext bestellen