MEMS Based Metal Plated Silicon Package for High Power LED von Oh, Yong Soo, Lee, Sung Jun, Choi, Seog Moon, Lim, Chang Hyun, Jeong, Won Kyu, Park, Ji Hyun

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Large Displacement Out-Of-Plane Bimorph Actuator for Optical Application von Kim, Yong Jun, Choi, Seog Moon, Jeung, Won Kyu

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Rectangular Microlens Array Having High Sag for Multi Chip LED Packaging von Choi, Seog Moon, Lim, Chang Hyun, Kim, Tae Hoon, Jeung, Won Kyu

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Large Displacement Polymer Bimorph Actuator for Out-of-plane Motion von Jeung, Won-Kyu, Choi, Seog-Moon, Kim, Yong-Jun

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Reflowable ISM WLP von Won Kyu Jeung, Chang Hyun Lim, Jingli Yuan, Seung Wook Park, Seog Moon Choi, Sung Yi

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Large Displacement Polymer Bimorph Actuator for Out-of-Plane Motion von Jeung Won-Kyu, Choi Seog-Moon, Kim Yong-Jun

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Miniaturization and Optimization of RF SAW Filter Using Wafer Level Packaging Technology von Tae Hoon Kim, Won Kyu Jeung, Si Joong Yang, Seog Moon Choi, Seung Wook Park, Hyun Ho Kim, Ha, J., Mi Jin Park, Kao, S., Hong, J.P., Sung Yi, Jun Sik Hwang, Ji Hyuk Lim, Woon Bae Kim

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Silicon-Based, Multi-Chip LED Package von Won Kyu Jeung, Sang Hyun Shin, Suk Youn Hong, Seog Moon Choi, Sung Yi, Young Bok Yoon, Hyun Jun Kim, Sung Jun Lee, Ki Yeol Park

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Stacked Anodized Metal Substrate for high thermal dissipation performance von Chang-Hyun Lim, Young-Ki Lee, Ki-Ho Seo, Jong-Woon Kim, Seog-Moon Choi

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Warpage simulation for chip-in-substrates von Jong Woon Kim, Ju Pyo Hong, Shan Gao, Seog Moon Choi, Sung Yi

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Development of lamination process for chip-in-substrates von Jong Woon Kim, Hwa Sun Park, Sang Chul Lee, Yul Kyo Chung, Seog Moon Choi, Sung Yi

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New Approach for Wafer Level Crystal Unit Package von Tae Hoon Kim, Jong Yeol Jeon, Yun Pyo Kwak, Ju Pyo Hong, Tae Ho Kim, Eun Jung Lim, Jang Ho Park, Seog Moon Choi, Sung Yi

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Interconnection via technology and wafer level package for crystal unit device von Tae Hoon Kim, Jong Yeol Jeon, Yun Pyo Kwak, Tae Ho Kim, Yun Jung Lim, Jang Ho Park, Seog Moon Choi, Sung Yi

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Aluminum Packaging for Light-Emitting Diode using Selectively Anodizing Method von Kim, Kyoung-Min, Lee, Young Ki, Shin, Sang-Hyun, Choi, Seog Moon, Kwon, Young Se

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Wafer Level Bonding for LED Packaging Using Six Sigma Methodology von Park, Ji Hyun, Lee, Sung Jun, Choi, Seog Moon

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Design and Characterization of Wafer Level SAW Filter Package Using LT-LT Wafer Structure von Tae Hoon Kim, Won Kyu Jeung, Si Joong Yang, Seog Moon Choi, Mi Jin Park, Jang Ho Park, Sung Yi, Jun Sik Hwang, Ji Hyuk Lim, Woon Bae Kim

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Sensing device von Chae, Joon Seok, Lee, Young Ki, Choi, Seog Moon, Ryu, Tae Gyu

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Sensing device von LEE YOUNG KI, CHAE JOON SEOK, RYU TAE GYU, CHOI SEOG MOON

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SENSING DEVICE von LEE, Young Ki, RYU, Tae Gyu, CHAE, Joon Seok, CHOI, Seog Moon

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Antenna apparatus von CHOI SUNG YOUL, LEE YOUNG KI, RYU TAE GYU, SEO BO HYUN, CHOI SEOG MOON, LEE HONG SEOK

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