Design of Various Dipolar Source for Improvement of Electrostatic Discharge Protection Performance of 0.18 μm_30 V DDDNMOS Transistor for High Voltage Application von Seo, Yong-Jin

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Impact of Depression on Work Productivity and Its Improvement after Outpatient Treatment with Antidepressants von Woo, Jong-Min, MD, MPH, PhD, Kim, Won, MD, PhD, Hwang, Tae-Yeon, MD, PhD, Frick, Kevin D., PhD, Choi, Byong Hwi, MD, Seo, Yong-Jin, MD, Kang, Eun-Ho, MD, Kim, Se Joo, MD, PhD, Ham, Byong-Joo, MD, PhD, Lee, Jun-Seok, MD, PhD, Park, Yu Lee, OMD, MPH

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Methodological Consideration on the Prediction of Electrochemical Mechanical Polishing Process Parameters by Monitoring of Electrochemical Characteristics of Copper Surface von Seo, Yong-Jin

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Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions von Kim, Nam-Hoon, Seo, Yong-Jin, Lee, Woo-Sun

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Chemical mechanical polishing of PZT thin films for FRAM applications von Seo, Yong-Jin, Park, Jin-Seong, Woo-Sun Lee

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Electrochemical–mechanical polishing application: Monitoring of electrochemical copper removal from current–voltage characteristics in HNO 3 electrolyte von Seo, Yong-Jin

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Structural and surface properties of NiCr thin films prepared by DC magnetron sputtering under variation of annealing conditions von Kwon, Yong, Kim, Nam-Hoon, Choi, Gwang-Pyo, Lee, Woo-Sun, Seo, Yong-Jin, Park, Jinseong

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Voltage-induced material removal mechanism of copper for electrochemical-mechanical polishing applications von HAN, Sang-Jun, SEO, Yong-Jin

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Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density von Seo, Yong-Jin, Kim, Sang-Yong, Choi, Yeon-Ok, Oh, Yong-Taek, Lee, Woo-Sun

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Effect of diluted colloidal silica slurry mixed with ceria abrasives on CMP characteristic von Lee, Youngkyun, Seo, Yong-Jin, Lee, Hojun, Jeong, Haedo

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Effects of oxidant additives for exact selectivity control of W- and Ti-CMP process von Seo, Yong-Jin, Lee, Woo-Sun

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Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation–chemical–mechanical polishing (STI–CMP) process von Kim, Sang-Yong, Seo, Yong-Jin

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CMP properties and fabrication of OLED using MEH-PPV von Lee, Woo-Sun, Choi, Gwon-Woo, Seo, Yong-Jin

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Reduction of process defects using a modified set-up for chemical mechanical polishing equipment von Seo, Yong-Jin, Kim, Sang-Yong, Lee, Woo-Sun

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N-Type Extended Drain Silicon Controlled Rectifier Electrostatic Discharge Protection Device for High-Voltage Operating Input/Output Applications von Seo, Yong-Jin, Kim, Kil-Ho

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A study on the correlation between electrochemical corrosion and chemical mechanical polishing performance of W and Ti film von Seo, Yong-Jin

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Motor-Current-Based Real-Time End Point Detection of Shallow-Trench-Isolation Chemical Mechanical Polishing Process Using High-Selectivity Slurry von Seo, Yong-Jin, Lee, Woo-Sun, Park, Jin-Seong, Kim, Sang-Yong

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Long-term treatment with long-acting risperidone in Korean patients with schizophrenia von Lee, Moon-Soo, Ko, Young-Hoon, Lee, Sang-Hoon, Seo, Yong-Jin, Kim, Seung-Hyun, Joe, Sook-Haeng, Han, Chang-Su, Lee, Jung-Ho, Jung, In-Kwa

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Electrostatic discharge (ESD) protection of N-type silicon controlled rectifier with P-type MOSFET pass structure for high voltage operating I/O application von Kim, Kil-Ho, Seo, Yong-Jin

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Effects of STI-fill thickness on the CMP process defects von Seo, Yong-Jin, Kim, Gi-Uk, Lee, Woo-Sun

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