Left-right symmetric composite Higgs model von Guan, Cong-Sen, Ma, Teng, Shu, Jing

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UV completed composite Higgs model with heavy composite partners von Dong, Zi-Yu, Guan, Cong-Sen, Ma, Teng, Shu, Jing, Xue, Xiao

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Twin Higgs with exact Z 2 von Csaba Csáki, Cong-Sen Guan, Teng Ma, Jing Shu

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Broadband Terahertz Detection by Laser Plasma with Balanced Optical Bias von Sun, Xu, Lyu, Zhi-Hui, Wu, Hai-Zhong, Meng, Cong-Sen, Zhang, Dong-Wen, Lu, Zhi-Zhong, Wang, Xiao-Wei, Zhao, Zeng-Xiu, Yuan, Jian-Min

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Generating a Higgs Potential Quartic Term von Csáki, Csaba, Guan, Cong-Sen, Ma, Teng, Shu, Jing

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Relationship between dynamic resistance and welding quality during resistance spot welding for micron AuNi9 wire von Zhang, Weiwei, Cong, Sen, Fang, Jihua, Tian, Yanhong

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GaAs Nanowire Array Solar Cells with Axial p–i–n Junctions von Yao, Maoqing, Huang, Ningfeng, Cong, Sen, Chi, Chun-Yung, Seyedi, M. Ashkan, Lin, Yen-Ting, Cao, Yu, Povinelli, Michelle L, Dapkus, P. Daniel, Zhou, Chongwu

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Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test von Cong, Sen, Liu, Peng, Wang, Shaobin, Xiong, Jinghua

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The reliability assessment of Au–Al bonds using parallel gap resistance microwelding von Liu, Peng, Cong, Sen, Tan, Xingwen, Lin, Xiang, Wu, Ping

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Carbon Nanotube Macroelectronics for Active Matrix Polymer-Dispersed Liquid Crystal Displays von Cong, Sen, Cao, Yu, Fang, Xin, Wang, Yufeng, Liu, Qingzhou, Gui, Hui, Shen, Chenfei, Cao, Xuan, Kim, Eun Sok, Zhou, Chongwu

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Enhancement of terahertz radiation from a filament by using circularly polarized two-color laser fields von Tu, Yan-Yun, Meng, Chao, Sun, Xu, Wu, Hai-Zhong, Song, Pan, Meng, Cong-Sen, Wang, Xiao-Wei, Zhou, Zhao-Yan, Lyu, Zhi-Hui, Zhang, Dong-Wen, Zhao, Zeng-Xiu, Yuan, Jian-Min

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Preparation of nitrogen-doped graphene supporting Pt nanoparticles as a catalyst for oxygen reduction and methanol oxidation von Liu, Cong-Sen, Liu, Xiao-Chen, Wang, Guo-Chong, Liang, Ru-Ping, Qiu, Jian-Ding

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Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test von Cong, Sen, Zhang, Weiwei, Zhang, He, Liu, Peng, Tan, Xingwen, Wu, Lang, An, Rong, Tian, Yanhong

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Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions von Li, Rui, Cong, Sen, Mei, Jiancheng, Zhang, Le, Chen, Zhuo, Li, Ting, Yuan, Xinjian

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Coal mine microseismic velocity model inversion based on first arrival time difference von Cong, Sen, Wang, Yun-hong, Cheng, Jian-Yuan

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Ultrasonic thickness measurement for aluminum alloy irregular surface parts based on spectral analysis von CONG, Sen, GANG, Tie

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Black Phosphorus Gas Sensors von Abbas, Ahmad N, Liu, Bilu, Chen, Liang, Ma, Yuqiang, Cong, Sen, Aroonyadet, Noppadol, Köpf, Marianne, Nilges, Tom, Zhou, Chongwu

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Effect of cooling rate and forced convection on as-cast structure of 2205 duplex stainless steel von Zhang, Cheng, Zhong, Hong-gang, Wu, Cong-sen, Ni, Jie, Zhai, Qi-jie

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Detection for printed circuit boards (PCBs) delamination defects using optical/thermal fusion imaging technique von Cong, Sen, Shang, Zhendong, Huang, Qinghua

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Thermomigration-induced failure in ball grid array solder joint under high current stressing von Liu, Peng, Cong, Sen, Wang, Shaobin, Wu, Ping

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