Electromigration Resistant Power Delivery Systems von Sekar, D.C., Dang, B., Davis, J.A., Meindl, J.D.

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Intsim: a CAD tool for optimization of multilevel interconnect networks von Sekar, D.C., Naeemi, A., Sarvari, R., Davis, J.A., Meindl, J.D.

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Clock trees: differential or single ended? von Sekar, D.C.

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The Impact of Multi-Core Architectures on Design of Chip-Level Interconnect Networks von Sekar, D.C., Meindl, J.D.

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Compact Physical Models for Power Supply Noise and Chip/Package Co-Design of Gigascale Integration von Gang Huang, Sekar, D.C., Naeemi, A., Shakeri, K., Meindl, J.D.

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