SURFACE-LEVEL BUOY ASSEMBLY FOR ETHERNET CONNECTIVITY OF A SUB-SURFACE MOBILE DEVICE von Vincent, Travis W, Thompson, Donald R, Schaeffer, Manda, Steffes, Zachary P, Seghi, Steve M, Cole, Aaron B

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Piezoelectric actuation of crack growth along polymer–metal interfaces in adhesive bonds von Du, Tianbao, Liu, Ming, Seghi, Steve, Hsia, K. J., Economy, J. Economy, Shang, J. K.

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