Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency von Wong, E.H., Seah, S.K.W., Caers, J.F.J.M., Lai, Y.-S.

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Board Level Drop Impact—Fundamental and Parametric Analysis von Wong, E. H, Mai, Y-W, Seah, S. K. W

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High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies von Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., Rajoo, R., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Leoni, M., Tan, L.C., Lai, Y.-S., Yeh, C.-L.

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A review of board level solder joints for mobile applications von Wong, E.H., Seah, S.K.W., Shim, V.P.W.

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Advances in the drop-impact reliability of solder joints for mobile applications von Wong, E.H., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Owens, N., Lai, Y.-S.

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Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading von Wong, E. H., Seah, S. K. W., Shim, V. P. W.

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Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling von Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

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Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading von Seah, S.K.W., Wong, E.H., Shim, V.P.W.

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Stress–strain characteristics of tin-based solder alloys at medium strain rate von Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

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Correlation studies for component level ball impact shear test and board level drop test von Wong, E.H., Rajoo, R., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Leoni, M., Eu, P.L., Lai, Y.-S., Yeh, C.-L.

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Optimization of filter frequency ratio in pseudo random modulated fiber amplifiers for maximally suppressing stimulated Brillouin scattering von Seah, S. K. W., Ye, Y. E., Lim, W. Y. W., Lam, L. C. Y., Lam, J. W., Wee, W. H., Seah, C. P., Tan, B. S.

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Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps von Selvanayagam, C.S., Lau, J.H., Xiaowu Zhang, Seah, S., Vaidyanathan, K., Chai, T.C.

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A Study of Crack Propagation in Pb-Free Solder Joints von Caers, J.F.J.M., Zhao, X.J., Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Owens, N., Leoni, M., Tan, L.C., Eu, P.L., Yi-Shao Lai, Chang-Lin Yeh

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Constitutive modeling of solder alloys for drop-impact applications von Wong, E.H., Chrisp, J., Selvanayagam, C.S., Seah, S.K.W.

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Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1 Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading von WONG, E. H, SEAH, S. K. W, SHIM, V. P. W

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The influence of pore morphology on corrosion von Seah, K.H.W., Thampuran, R., Teoh, S.H.

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Development of Stretch Solder Interconnections for Wafer Level Packaging von Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.

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Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps von Selvanayagam, C.S., Lau, J.H., Xiaowu Zhang, Seah, S.K.W., Vaidyanathan, K., Chai, T.C.

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High-speed bend test method and failure prediction for drop impact reliability von Seah, S.K.W., Wong, E.H., Mai, Y.W., Rajoo, R., Lim, C.T.

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Micro impact characterisation of solder joint for drop impact application von Wong, E.H., Mai, Y.-W., Rajoo, R., Tsai, K.T., Liu, F., Seah, S.K.W., Yeh, C.-L.

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