A review of board level solder joints for mobile applications von Wong, E.H., Seah, S.K.W., Shim, V.P.W.

Volltext

Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency von Wong, E.H., Seah, S.K.W., Caers, J.F.J.M., Lai, Y.-S.

Volltext

Board Level Drop Impact—Fundamental and Parametric Analysis von Wong, E. H, Mai, Y-W, Seah, S. K. W

Volltext

Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading von Wong, E. H., Seah, S. K. W., Shim, V. P. W.

Volltext

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies von Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., Rajoo, R., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Leoni, M., Tan, L.C., Lai, Y.-S., Yeh, C.-L.

Volltext

Advances in the drop-impact reliability of solder joints for mobile applications von Wong, E.H., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Owens, N., Lai, Y.-S.

Volltext

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling von Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

Volltext

Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading von Seah, S.K.W., Wong, E.H., Shim, V.P.W.

Volltext

Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1 Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading von WONG, E. H, SEAH, S. K. W, SHIM, V. P. W

Volltext

Stress–strain characteristics of tin-based solder alloys at medium strain rate von Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

Volltext

Correlation studies for component level ball impact shear test and board level drop test von Wong, E.H., Rajoo, R., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Leoni, M., Eu, P.L., Lai, Y.-S., Yeh, C.-L.

Volltext

Optimization of filter frequency ratio in pseudo random modulated fiber amplifiers for maximally suppressing stimulated Brillouin scattering von Seah, S. K. W., Ye, Y. E., Lim, W. Y. W., Lam, L. C. Y., Lam, J. W., Wee, W. H., Seah, C. P., Tan, B. S.

Volltext

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps von Selvanayagam, C.S., Lau, J.H., Xiaowu Zhang, Seah, S., Vaidyanathan, K., Chai, T.C.

Volltext

The influence of pore morphology on corrosion von Seah, K.H.W., Thampuran, R., Teoh, S.H.

Volltext

A Study of Crack Propagation in Pb-Free Solder Joints von Caers, J.F.J.M., Zhao, X.J., Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Owens, N., Leoni, M., Tan, L.C., Eu, P.L., Yi-Shao Lai, Chang-Lin Yeh

Volltext

Constitutive modeling of solder alloys for drop-impact applications von Wong, E.H., Chrisp, J., Selvanayagam, C.S., Seah, S.K.W.

Volltext

Tool wear acceleration in relation to workpiece reinforcement percentage in cutting of metal matrix composites von Li, Xiaoping, Seah, W.K.H

Volltext

Binder use obscures traumatic pelvic injury in a 29-year-old man von Seah, K T Matthew, MacKay, James W

Volltext

Performance evaluation of cryogenically treated tungsten carbide tools in turning von Yong, A.Y.L., Seah, K.H.W., Rahman, M.

Volltext

Development of Stretch Solder Interconnections for Wafer Level Packaging von Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.

Volltext