Nonlinear electrochemical impedance spectroscopy for solid oxide fuel cell cathode materials von Wilson, J.R., Schwartz, D.T., Adler, S.B.

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An evaluation of indoor and outdoor biological particulate matter von Menetrez, M.Y., Foarde, K.K., Esch, R.K., Schwartz, T.D., Dean, T.R., Hays, M.D., Cho, S.H., Betancourt, D.A., Moore, S.A.

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Electrodeposited Nanocomposite n-p Heterojunctions for Solid-State Dye-Sensitized Photovoltaics von O'Regan, B., Schwartz, D. T., Zakeeruddin, S. M., Grätzel, M.

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Electrochemical printing: software reconfigurable electrochemical microfabrication von Whitaker, J D, Nelson, J B, Schwartz, D T

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MATERIALS ASSEMBLY AND FORMATION USING ENGINEERED POLYPEPTIDES von Sarikaya, M, Tamerler, C, Schwartz, D T, Baneyx, F

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Molecular dynamics simulation of ion selectivity traits of nickel hexacyanoferrate thin films von 郝晓刚 YU Qiu-ming JIANG Shao-yi D. T. SCHWARTZ

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High-rate through-mold electrodeposition of thick (>200 /spl mu/m) NiFe MEMS components with uniform composition von Leith, S.D., Schwartz, D.T.

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Probing liquid distribution in partially saturated porous materials with hydraulic admittance von Cheung, P., Fairweather, J. F., Schwartz, D. T.

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Controlled multibatch self-assembly of microdevices von Xiaorong Xiong, Hanein, Y., Jiandong Fang, Yanbing Wang, Weihua Wang, Schwartz, D.T., Bohringer, K.F.

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Characterization of Cathodically Deposited Nickel Hexacyanoferrate for Electrochemically Switched Ion Exchange von JEERAGE, KAVITA M., SCHWARTZ, DANIEL T.

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Through-mold electrodeposition using the uniform injection cell (UIC): Workpiece and pattern scale uniformity von Leith, S.D, Schwartz, D.T

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Nonequilibrium Synthesis and Assembly of Hybrid Inorganic−Protein Nanostructures Using an Engineered DNA Binding Protein von Dai, Haixia, Choe, Woo-Seok, Thai, Corrine K, Sarikaya, Mehmet, Traxler, Beth A, Baneyx, François, Schwartz, Daniel T

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Localized Electrodeposition and Patterning Using Bipolar Electrochemistry von Braun, T. M., Schwartz, D. T.

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High Peclet number mass transfer in the acoustic streaming flow between two concentric cylinders von Bowman, J.A., Schwartz, D.T.

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The Emerging Role of Electrodeposition in Additive Manufacturing von Braun, Trevor M., Schwartz, Daniel T.

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Characterization of NixFe1-x (0.10 < x < 0.95) electrodeposition from a family of sulfamate-chloride electrolytes von LEITH, S. D, RAMLI, S, SCHWARTZ, D. T

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Efficient Photo-Hole Injection from Adsorbed Cyanine Dyes into Electrodeposited Copper(I) Thiocyanate Thin Films von O'Regan, Brian, Schwartz, Daniel T

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Flow-induced composition modulated NiFe thin films with nanometer-scale wavelengths von LEITH, S. D, SCHWARTZ, D. T

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Comparison of light emission from stain-etch and anodic-etch silicon films von KIDDER, J. N, WILLIAMS, P. S, PEARSALL, T. P, SCHWARTZ, D. T, NOSHO, B. Z

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Cities, winter birth, and schizophrenia von Schwartz, D T

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