Traceable Coplanar Waveguide Calibrations on Fused Silica Substrates up to 110 GHz von Arz, Uwe, Kuhlmann, Karsten, Dziomba, Thorsten, Hechtfischer, Gerd, Phung, Gia Ngoc, Schmuckle, Franz Josef, Heinrich, Wolfgang

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Crosstalk Corrections for Coplanar-Waveguide Scattering-Parameter Calibrations von Williams, Dylan F., Schmuckle, Franz-Josef, Doerner, Ralf, Gia Ngoc Phung, Arz, Uwe, Heinrich, Wolfgang

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Flip-Chip Approach for 500 GHz Broadband Interconnects von Sinha, Siddhartha, Doerner, Ralf, Schmuckle, Franz-Josef, Monayakul, Sirinpa, Hrobak, Michael, Weimann, Nils G., Krozer, Viktor, Heinrich, Wolfgang

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Connecting Chips With More Than 100 GHz Bandwidth von Heinrich, Wolfgang, Hossain, Maruf, Sinha, Siddhartha, Schmuckle, Franz-Josef, Doerner, Ralf, Krozer, Viktor, Weimann, Nils

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SciFab -a wafer-level heterointegrated InP DHBT/SiGe BiCMOS foundry process for mm-wave applications von Weimann, Nils G., Stoppel, Dimitri, Schukfeh, Muhammed I., Hossain, Maruf, Al-Sawaf, Thualfiqar, Janke, Bernd, Doerner, Ralf, Sinha, Siddharta, Schmückle, Franz-Josef, Krüger, Olaf, Krozer, Viktor, Heinrich, Wolfgang, Lisker, Marco, Krüger, Andreas, Datsuk, Anton, Meliani, Chafik, Tillack, Bernd

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Multifinger Indium Phosphide Double-Heterostructure Transistor Circuit Technology With Integrated Diamond Heat Sink Layer von Nosaeva, Ksenia, Al-Sawaf, Thualfiqar, John, Wilfred, Stoppel, Dimitri, Rudolph, Matthias, Schmuckle, Franz-Josef, Janke, Bernd, Kruger, Olaf, Krozer, Viktor, Heinrich, Wolfgang, Weimann, Nils G.

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InP DHBT Process in Transferred-Substrate Technology With ft and fmax Over 400 GHz von KRAEMER, Tomas, RUDOLPH, Matthias, SCHMUECKLE, Franz Josef, WUERFL, Joachim, TRAENKLE, Guenther

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InP-DHBT-on-BiCMOS Technology With f/f of 400/350 GHz for Heterogeneous Integrated Millimeter-Wave Sources von Kraemer, T., Ostermay, I., Jensen, T., Johansen, T. K., Schmueckle, F., Thies, A., Krozer, V., Heinrich, W., Krueger, O., Traenkle, G., Lisker, M., Trusch, A., Kulse, P., Tillack, B.

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InP DHBT Process in Transferred-Substrate Technology With f and f Over 400 GHz von Kraemer, T., Rudolph, M., Schmueckle, F.J., Wuerfl, J., Traenkle, G.

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Simulation of RF Power Distribution in a Packaged GaN Power Transistor Using an Electro-Thermal Large-Signal Description von Schnieder, F., Bengtsson, O., Schmuckle, F., Rudolph, M., Heinrich, W.

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Traveling-Wave Amplifiers in Transferred Substrate InP-HBT Technology von Kraemer, T., Meliani, C., Schmueckle, F.J., Wuerfl, J., Traenkle, G.

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Performance study of a 248 GHz voltage controlled hetero-integrated source in InP-on-BiCMOS technology von Hossain, Maruf, Ostermay, Ina, Weimann, Nils G., Schmueckle, Franz Josef, Borngraeber, Johannes, Meliani, Chafik, Lisker, Marco, Tillack, Bernd, Krueger, Olaf, Krozer, Viktor, Heinrich, Wolfgang

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InP-DHBT-on-BiCMOS Technology With [Formula Omitted] of 400/350 GHz for Heterogeneous Integrated Millimeter-Wave Sources von Kraemer, Tomas, Ostermay, Ina, Jensen, Thomas, Johansen, Tom Keinicke, Schmueckle, Franz-Josef, Thies, Andreas, Krozer, Viktor, Heinrich, Wolfgang, Krueger, Olaf, Traenkle, Guenther, Lisker, Marco, Trusch, Andreas, Kulse, Philipp, Tillack, Bernd

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InP-DHBT-on-BiCMOS Technology With fT/fmax of 400/350 GHz for Heterogeneous Integrated Millimeter-Wave Sources von KRAEMER, Tomas, OSTERMAY, Ina, LISKER, Marco, TRUSCH, Andreas, KULSE, Philipp, TILLACK, Bernd, JENSEN, Thomas, KEINICKE JOHANSEN, Tom, SCHMUECKLE, Franz-Josef, THIES, Andreas, KROZER, Viktor, HEINRICH, Wolfgang, KRUEGER, Olaf, TRAENKLE, Guenther

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Finite-difference formulation accounting for field singularities von Zscheile, H., Schmuckles, F.J., Heinrich, W.

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Optimizing the FDFD Method in Order to Minimize PML-Related Numerical Problems von Talukder, P.K., Schmuckle, F.-J., Schlundt, R., Heinrich, W.

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A 24 GHz Active Antenna in Flip-Chip Technology with Integrated Frontend von Talukder, P.K., Neuner, M., Meliani, C., Schmuckle, F.J., Heinrich, W.

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Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies von Zoschke, K., Wolf, M.J., Topper, M., Ehrmann, O., Fritzsch, T., Kaletta, K., Schmuckle, F.-J., Reichl, H.

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MICROWAVE CIRCUIT ASSEMBLY von SCHMUECKLE FRANZ JOSEF, PURDEN GEORGE J, WALSH MATTHEW R

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Plaited-Signal-Manifold-Anschlussstruktur für ein Hochfrequenzbauelement und ein solches Hochfrequenzbauelement von KLOCKENHOFF, HARALD, SCHMUECKLE, FRANZ-JOSEF

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