A new view on J-integrals in elastic–plastic materials von Kolednik, O., Schöngrundner, R., Fischer, F. D.

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High resolution determination of local residual stress gradients in single- and multilayer thin film systems von Treml, R., Kozic, D., Zechner, J., Maeder, X., Sartory, B., Gänser, H.-P., Schöngrundner, R., Michler, J., Brunner, R., Kiener, D.

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Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method von Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W., Kiener, D., Brunner, R.

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On configurational forces at boundaries in fracture mechanics von Fischer, F. D., Simha, N. K., Predan, J., Schöngrundner, R., Kolednik, O.

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Mechanical properties of low-alloy-steels with bainitic microstructures and varying carbon content von Weber, A, Klarner, J, Vogl, T, Schöngrundner, R, Sam, G, Buchmayr, B

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Miniaturized fracture experiments to determine the toughness of individual films in a multilayer system von Treml, R., Kozic, D., Schöngrundner, R., Kolednik, O., Gänser, H.-P., Brunner, R., Kiener, D.

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Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations von Schöngrundner, R., Cordill, M.J., Maier, G.A., Gänser, H.-P.

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Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly Process von Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., Lecavelier, A.

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The Configurational Force Concept in Elastic-Plastic Fracture Mechanics−Instructive Examples von Fischer, Franz Dieter, Schöngrundner, R., Kolednik, Otmar

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Stress and Deflection Development During Die Embedding into Printed Circuit Boards von Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., Lecavelier, A.

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Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process von Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., Lecavelier, A.

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Adhesion of printed circuit boards with bending and the effect of reflow cycles von Schongrundner, R., Cordill, M. J., Berger, J., Kruckl, H., Fellner, K., Krivec, T., Kurz, M., Fuchs, P. F., Maier, G. A.

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Multi-physics simulation of the component attachment within embedding process von Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M., Brizoux, M.

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