Thermo-mechanical properties and regression models of alloys: AISI 305, CK 60, CuBe2 and Laiton MS 63 von Tan, X., Conway, P.P., Sarvar, F.

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Adhesion of Precision Welded Lead-Free Electrical Interconnects Formed by Molten Droplet Deposition von Webb, D P, Liu, C, Sarvar, F, Conway, P P, Williams, K

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PCB glass-fibre laminates : thermal conductivity measurements and their effect on simulation von SARVAR, F, POOLE, N. J, WITTING, P. A

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Examination of natural convection plumes from partially heated PCB plates and estimation of the heat transfer coefficients von SARVAR, F, WITTING, P. A, POOLE, N. J

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Convection heat transfer from a hybrid circuit von SARVAR, F, WITTING, P. A, POOLE, N. J

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Application of adhesives in MEMS and MOEMS assembly: a review von Sarvar, F., Hutt, D.A., Whalley, D.C.

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Modelling of solder joint geometry for quality and reliability von Whalley, D C, Conway, P P, Sarvar, F, Williams, D J

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Modelling of Solder Joint Geometry for Quality and Reliability von Whalley, D.C, Conway, P.P, Sarvar, F, Williams, D.J

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Failure Mechanisms of Dummy IGBT Assembles Constructed using Liquid In-Sn/Nb System von Jianfeng Li, Sarvar, F., Whalley, D.C., Hutt, D.A., Clode, M.P., Mannan, S.H.

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IGBT package design for high power aircraft electronic systems von Sarvar, F., Whalley, D.C.

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A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies: Electronics packaging von SARVAR, F, CONWAY, P. P

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Observed Phenomenology of the Interaction between Solder Paste and Soldering Processes von Kalantary, M.R, Sarvar, F, Conway, P.P, Williams, D.J, Whalley, D.C

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Effective transient process modelling of the reflow soldering of printed circuit assemblies von Sarvar, F., Conway, P.P.

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A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies von Sarvar, Farhad, Conway, Paul P

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Thermo-mechanical modelling of polymer encapsulated electronics von Sarvar, F., Teh, N.J., Whalley, D.C., Huntt, D.A., Palmer, P.J.

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IGBT Package Design for High Power Aircraft Electronic Systems von Sarvar, Farhad, Whalley, David C, Low, Ming K

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THERMAL DESIGN OF HIGH POWER SEMICONDUCTOR PACKAGES FOR AIRCRAFT SYSTEMS von SARVAR, FARHAD, WHALLEY, DAVID C.

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Effective modeling of the reflow soldering process: basis, construction, and operation of a process model von Sarvar, F., Conway, P.P.

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Effective modeling of the reflow soldering process: use of a modeling tool for product and process design von Sarvar, F., Conway, P.P.

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Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly von Ochana, A.R., Hutt, D.A., Whalley, D.C., Sarvar, F., Al-Habaibeh, A.

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