Ecological indicators based on quantitative eDNA metabarcoding: the case of marine reserves von Sanchez, Loïc, Boulanger, Emilie, Arnal, Véronique, Boissery, Pierre, Dalongeville, Alicia, Dejean, Tony, Deter, Julie, Guellati, Nacim, Holon, Florian, Juhel, Jean-Baptiste, Lenfant, Philippe, Leprieur, Fabien, Valentini, Alice, Manel, Stéphanie, Mouillot, David

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Rarity mediates species‐specific responses of tropical reef fishes to protection von Sanchez, Loïc, Loiseau, Nicolas, Edgar, Graham J., Hautecoeur, Cyril, Leprieur, Fabien, Manel, Stéphanie, McLean, Matthew, Stuart‐Smith, Rick D., Velez, Laure, Mouillot, David

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The long‐term impacts of Marine Protected Areas on fish catch and socioeconomic development in Tanzania von Desbureaux, Sébastien, Girard, Julia, Dalongeville, Alicia, Devillers, Rodolphe, Mouillot, David, Jiddawi, Narriman, Sanchez, Loic, Velez, Laure, Mathon, Laetitia, Leblois, Antoine

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Germanium-on-insulator (GeOI) substrates—A novel engineered substrate for future high performance devices von Akatsu, Takeshi, Deguet, Chrystel, Sanchez, Loic, Allibert, Frédéric, Rouchon, Denis, Signamarcheix, Thomas, Richtarch, Claire, Boussagol, Alice, Loup, Virginie, Mazen, Frédéric, Hartmann, Jean-Michel, Campidelli, Yves, Clavelier, Laurent, Letertre, Fabrice, Kernevez, Nelly, Mazure, Carlos

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SiO2-SiO2 die-to-wafer direct bonding interface weakening von Tabata, Toshiyuki, Sanchez, Loic, Larrey, Vincent, Fournel, Frank, Moriceau, Hubert

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Large‐Diameter III–V on Si Substrates by the Smart Cut Process: The 200 mm InP Film on Si Substrate Example von Ghyselen, Bruno, Navone, Christelle, Martinez, Muriel, Sanchez, Loic, Lecouvey, Christophe, Montmayeul, Brigitte, Servant, Florence, Maitrejean, Sylvain, Radu, Ionut

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Large‐Diameter III–V on Si Substrates by the Smart Cut Process: The 200 mm InP Film on Si Substrate Example von Ghyselen, Bruno, Navone, Christelle, Martinez, Muriel, Sanchez, Loic, Lecouvey, Christophe, Montmayeul, Brigitte, Servant, Florence, Maitrejean, Sylvain, Radu, Ionut

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Benchmarking eleven biodiversity indicators based on environmental DNA surveys: More diverse functional traits and evolutionary lineages inside marine reserves von Dalongeville, Alicia, Boulanger, Emilie, Marques, Virginie, Charbonnel, Eric, Hartmann, Virginie, Santoni, Marie Catherine, Deter, Julie, Valentini, Alice, Lenfant, Philippe, Boissery, Pierre, Dejean, Tony, Velez, Laure, Pichot, Franck, Sanchez, Loic, Arnal, Veronique, Bockel, Thomas, Delaruelle, Gwenaelle, Holon, Florian, Milhau, Tristan, Romant, Lola, Manel, Stéphanie, Mouillot, David

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Epitaxial Growth of High‐Quality AlGaInAs‐Based Active Structures on a Directly Bonded InP‐SiO2/Si Substrate von Besancon, Claire, Vaissiere, Nicolas, Dupré, Cécilia, Fournel, Frank, Sanchez, Loic, Jany, Christophe, David, Sylvain, Bassani, Franck, Baron, Thierry, Decobert, Jean

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Enabling 3D Monolithic Integration von Batude, Perrine, Vinet, Maud, Pouydebasque, Arnaud, Clavelier, Laurent, LeRoyer, Cyrille, Tabone, Claude, Previtali, Bernard, Sanchez, Loic, Baud, Laurence, Roman, Antonio, Carron, Véronique, Nemouchi, Fabrice, Pocas, Stéphane, Comboroure, Corine, Mazzocchi, Vincent, Grampeix, Helen, Aussenac, François, Deleonibus, Simon

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Epitaxial Growth of High‐Quality AlGaInAs‐Based Active Structures on a Directly Bonded InP‐SiO 2 /Si Substrate von Besancon, Claire, Vaissiere, Nicolas, Dupré, Cécilia, Fournel, Frank, Sanchez, Loic, Jany, Christophe, David, Sylvain, Bassani, Franck, Baron, Thierry, Decobert, Jean

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Collective Die Direct Bonding for Photonic on Silicon von Sanchez, Loic, Fournel, Frank, Montmayeul, Brigitte, Bally, Laurent, Szelag, Bertrand, Adelmini, Laetitia

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Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force von Berthier, Jean, Mermoz, Sébastien, Brakke, Kenneth, Sanchez, Loic, Frétigny, Christian, Cioccio, Léa Di

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(Invited) Heterogeneously Integrated III-V on Silicon Lasers von Ben Bakir, Badhise, Sciancalepore, Corrado, Descos, Antoine, Duprez, Hélène, Bordel, Damien, Sanchez, Loic, Jany, Christophe, Hassan, Karim, Brianceau, Pierre, Carron, Veronique, Menezo, Sylvie

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Chip to wafer copper direct bonding electrical characterization and thermal cycling von Beilliard, Yann, Coudrain, Perceval, Di Cioccio, Lea, Moreau, Stephane, Sanchez, Loic, Montmayeul, Brigitte, Signamarcheix, Thomas, Estevez, Rafael, Parry, Guillaume

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(Invited) Die to Wafer Direct Bonding: Overview of Processes for Optoelectronic and 3D at CEA von Montméat, Pierre, Castan, Clement, Nadi, Noura, Fournel, Frank, Bourjot, Emilie, Szelag, Bertrand, Hassan, Karim, Sanchez, Loic

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(Invited) Advanced III-V-on-Si Heterogeneously Integrated Platforms for Next Generation Silicon Photonics Integrated Circuits von Besancon, Claire, Souleiman, Amin, Néel, Delphine, Vaissiere, Nicolas, Ramez, Valentin, Fournel, Frank, Sanchez, Loic, Malhouitre, Stéphane, Hassan, Karim, Decobert, Jean, Bitauld, David, Ramirez, Joan

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METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING von FOURNEL, Frank, SANCHEZ, Loic, MONTMAYEUL, Brigitte

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METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING von FOURNEL, Frank, SANCHEZ, Loic, MONTMAYEUL, Brigitte

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Method for transferring chips von Sanchez, Loic, Fournel, Frank, Bourjot, Emilie, Maitrejean, Sylvain, Cheramy, Séverine

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