The Investigation of Substrate’s Dielectric Properties for Improving the Performance of Witricity Devices von Salleh, Mohd H M, Seman, Norhudah, Raimi Dewan

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Investigation of Unequal Planar Wireless Electricity Device for Efficient Wireless Power Transfer von Mohd Salleh, E., Seman, E., Abang Zaidel, E., Eteng, E.

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Effect of reduction roasting by using bio-char derived from empty fruit bunch on the magnetic properties of Malaysian iron ore von Yunus, Nurul A., Ani, Mohd H., Salleh, Hamzah M., Rashid, Rusila Z. A., Akiyama, Tomohiro, Purwanto, Hadi, Othman, Nur E. F.

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Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder von Mohd Salleh, M.A.A., Bakri, A.M. Mustafa Al, Zan@Hazizi, M.H., Somidin, Flora, Mohd Alui, Noor Farhani, Ahmad, Zainal Arifin

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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering von Ramli, M.I.I., Mohd Salleh, M.A.A., Yasuda, H., Chaiprapa, J., Nogita, K.

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Molecular design strategies for spin-crossover (SCO) metal complexes (Fe(II) and Co(II)) for thermoelectricity von Nik Ibrahim, N.M.J., Said, S. Mohd, Mainal, A., Mohd Sabri, M.F., Abdullah, N., Megat Hasnan, M.M.I., Che Hassan, H., Mohd Salleh, M.F., Wan Mohd Mahiyiddin, W.A.

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Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces von Mohd Salleh, M.A.A., McDonald, S.D., Yasuda, H., Sugiyama, A., Nogita, K.

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Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process von Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H., Nogita, K.

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Antinociceptive Activity of Petroleum Ether Fraction of Clinacanthus nutans Leaves Methanolic Extract: Roles of Nonopioid Pain Modulatory Systems and Potassium Channels von Salleh, M. Z., Omar, Maizatul Hasyima, Marmaya, Najihah Hanisah, Sani, M. H. Mohd, Roosli, Rushduddin Al Jufri, Abdul Rahim, Mohammad Hafiz, Zakaria, Zainul Amiruddin, Teh, L. K.

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Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles von Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Yasuda, H., Nogita, K.

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Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste von Mohd Said, R., Mohd Salleh, M. A. A., Saud, N., Ramli, M. I. I., Yasuda, H., Nogita, K.

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Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength von Muhd Amli, S. F. N., Mohd Salleh, M. A. A., Ramli, M. I. I., Abdul Razak, N. R., Yasuda, H., Chaiprapa, J., Nogita, K.

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Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy von Mohd Salleh, M.A.A., McDonald, S.D., Terada, Y., Yasuda, H., Nogita, K.

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The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint von Chang, M.S., Mohd Salleh, M.A.A., Somidin, F., Halin, D.S.C., Yasuda, H., Nogita, K.

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A comprehensive review on the physicochemical properties of deep eutectic solvents von Yeow, Andrew T.H., Hayyan, Adeeb, Hayyan, Maan, Usman Mohd Junaidi, Mohd, Saleh, Jehad, Jefrey Basirun, Wan, Roslan Mohd Nor, Mohd, Al Abdulmonem, Waleed, Zulhaziman M. Salleh, M., Mohamed Zuki, Fathiah, Diana Hamid, Mahar

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Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni von Xian, J.W., Mohd Salleh, M.A.A., Belyakov, S.A., Su, T.C., Zeng, G., Nogita, K., Yasuda, H., Gourlay, C.M.

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The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy von Chang, M.S., Salleh, M.A.A. Mohd, Halin, D.S.C., Ramli, M.I.I., Yasuda, H., Nogita, K.

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Energy and rice quality aspects during drying of freshly harvested paddy with industrial inclined bed dryer von Sarker, M.S.H., Ibrahim, M. Nordin, Ab. Aziz, N., Mohd. Salleh, P.

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In situ imaging of microstructure formation in electronic interconnections von Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D., Nogita, K.

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Initial Study on Rheological Behaviour of Hydroxyapatites / Polylactic Acid Composite for 3D Printing Filament von Marzuki, Afeeqa Puteri, Mohd Nasir, Mohd Alfiqrie, Mohd Salleh, Farrahshaida, Ismail, Muhammad Hussain, Murat, Bibi Intan Suraya, Ibrahim, Marzuki

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