Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: EPITS 2022, 14-15 September, Langkawi, Malaysia von Mohd Salleh, Mohd Arif Anuar, Che Halin, Dewi Suriyani, Abdul Razak, Kamrosni, Ramli, Mohd Izrul Izwan

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Diverse material based geopolymer towards heavy metals removal: a review von Arokiasamy, Pilomeena, Abdullah, Mohd Mustafa Al Bakri, Abd Rahim, Shayfull Zamree, Sadique, Monower, Ming, Liew Yun, Mohd Salleh, Mohd Arif Anuar, Mohd Arif Zainol, Mohd Remy Rozainy, Ghazali, Che Mohd Ruzaidi

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Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Met... von Ahmed, Faizan, Abdul Aziz, Mohd Sharizal, Mohd Arif Zainol, Mohd Remy Rozainy, Yee, Khor Chu, Shaik, Feroz, Che Halin, Dewi Suriyani, Mohd Salleh, Mohd Arif Anuar, Kheimi, Marwan

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Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints von Kobayashi, Tatsuya, Oyama, Marina, Mohd Salleh, Mohd Arif Anuar, Shohji, Ikuo

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Bonding Strength Characteristics of FA-Based Geopolymer Paste as a Repair Material When Applied on OPC Substrate von Ahmad Zailani, Warid Wazien, Bouaissi, Aissa, Abdullah, Mohd Mustafa Al Bakri, Abd Razak, Rafiza, Yoriya, Sorachon, Mohd Salleh, Mohd Arif Anuar, Rozainy M. A. Z., Mohd Remy, Fansuri, Hamzah

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Synthesis of Kaolin Geopolymer as Ceramic Reinforcement in Lead-Free Solder von Mohamad Zaimi, Nur Syahirah, Izwan Ramli, Mohd Izrul, Mohd Salleh, Mohd Arif Anuar, Bakri Abdullah, Mohd Mustafa Al, Chaiprapa, Jitrin, Abdul Aziz, Mohd Shahrizal

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Preliminary investigation on the correlation between mechanical properties and conductivity of low-density polyethylene/carbon black (LDPE/CB) conductive polymer composite (CPC) von Badrul, Farah, Abdul Halim, Khairul Anwar, Mohd Salleh, Mohd Arif Anuar, Omar, Mohd Firdaus, Zakaria, Azlin Fazlina, Muhamad, Nor Asiah, Zakaria, Muhammad Salihin

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Metakaolin/sludge based geopolymer adsorbent on high removal efficiency of Cu2 von Arokiasamy, Pilomeena, Abdullah, Mohd Mustafa Al Bakri, Abd Rahim, Shayfull Zamree, Mohd Arif Zainol, Mohd Remy Rozainy, Mohd Salleh, Mohd Arif Anuar, Kheimi, Marwan, Chaiprapa, Jitrin, Sandu, Andrei Victor, Vizureanu, Petrica, Abdul Razak, Rafiza, Jamil, Noorina Hidayu

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A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy von Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Al Bakri Abdullah, Mohd Mustafa, Ramli, Mohd Izrul Izwan

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Metal-Doped TiO2 Thin Film as an Electron Transfer Layer for Perovskite Solar Cells: A Review von Che Halin, Dewi Suriyani, Azhari, Ayu Wazira, Mohd Salleh, Mohd Arif Anuar, Muhammad Nadzri, Nur Izzati, Vizureanu, Petrica, Abdullah, Mohd Mustafa Al Bakri, Wahab, Juyana A., Sandu, Andrei Victor

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High-Entropy Alloy for Thin Film Application: A Review von Muhammad Nadzri, Nur Izzati, Halin, Dewi Suriyani Che, Al Bakri Abdullah, Mohd Mustafa, Joseph, Sudha, Mohd Salleh, Mohd Arif Anuar, Vizureanu, Petrica, Burduhos-Nergis, Diana-Petronela, Sandu, Andrei Victor

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Imaging the Polymorphic Transformation in a Single Cu₆Sn₅ Grain in a Solder Joint von Somidin, Flora, Maeno, Hiroshi, Tran, Xuan Quy, D McDonald, Stuart, Mohd Salleh, Mohd Arif Anuar, Matsumura, Syo, Nogita, Kazuhiro

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Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process von Ahmad, Muhammad Iqbal, Abdul Aziz, Mohd Sharizal, Abdullah, Mohd Zulkifly, Salleh, Mohd Arif Anuar Mohd, Ishak, Mohammad Hafifi Hafiz, Rahiman, Wan, Nabiałek, Marcin

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The effect of Aluminium addition on the microstructure of lead-free solder alloys: A short review von Tan, Chi Ying, Salleh, Mohd Arif Anuar Mohd

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Current advancement in electrically conductive polymer composites for electronic interconnect applications: A short review von Badrul, Farah, Halim, Khairul Anwar Abdul, Salleh, Mohd Arif Anuar Mohd, Omar, Mohd Firdaus, Osman, Azlin Fazlina, Zakaria, Mohd Salihin

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Sn Whiskers Nucleation and Growth - Short Review von Mokhtar, N. Mohd, Mohd Salleh, Mohd Arif Anuar

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Spontaneous Tin (Sn) Whisker Growth from Electroplated Tin and Lead-Free Tin Alloys Coatings: A Short Review von Hashim, Aimi Noorliyana, Mohd Salleh, Mohd Arif Anuar

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Effect of rare-element (Ga) addition on the microstructure and mechanical properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni lead-free solder alloys von Nazri, Sufian Firdaus, Salleh, Mohd Arif Anuar Mohd

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Molecular dynamics simulation of the nano- reinforced lead-free solder at different reflow soldering process temperature von Sahrudin, Intan Norshalina, Aziz, Mohd Shahrizal Abdul, Abdullah, Mohd Zulkifly, Salleh, Mohd Arif Anuar Mohd

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Effects of Gallium addition on the thermal properties and whiskers growth under electrical current stressing von Mokhtar, Noor Zaimah Mohd, Salleh, Mohd Arif Anuar Mohd, Hashim, Aimi Noorliyana, Nazri, Sufian Firdaus

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