Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics von Vanstreels, Kris, Salahouelhadj, Abdellah, Gonzalez, Mario

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Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding von Oprins, Herman, Cherman, Vladimir, Webers, Tomas, Salahouelhadj, Abdellah, Kim, Soon-Wook, Peng, Lan, Van der Plas, Geert, Beyne, Eric

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Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding von Tsau, Yan Wen, De Messemaeker, Joke, Salahouelhadj, Abdellah, Gonzalez, Mario, Witters, Liesbeth, Zhang, Boyao, Seefeldt, Marc, Beyne, Eric, De Wolf, Ingrid

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Modeling of the cyclic behavior of elastic–viscoplastic composites by the additive tangent Mori–Tanaka approach and validation by finite element calculations von Czarnota, C., Kowalczyk-Gajewska, K., Salahouelhadj, A., Martiny, M., Mercier, S.

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Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding von Tsau, Yan Wen, De Messemaeker, Joke, Salahouelhadj, Abdellah, Gonzalez, Mario, Witters, Liesbeth, Zhang, Boyao, Seefeldt, Marc, Beyne, Eric, De Wolf, Ingrid

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Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications von Salahouelhadj, A., Martiny, M., Mercier, S., Bodin, L., Manteigas, D., Stephan, B.

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Application of the continuum shell finite element SHB8PS to sheet forming simulation using an extended large strain anisotropic elastic–plastic formulation von Salahouelhadj, A., Abed-Meraim, F., Chalal, H., Balan, T.

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