Catalytic characteristics of Ni(B)-coated YSZ powder by neutral electroless plating von Rha, Sa-Kyun, Lee, Mi-Jai, Lee, Youn-Seoung

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Growth studies and characterization of silicon nitride thin films deposited by alternating exposures to Si2Cl6 and NH3 von PARK, Kwangchol, YUN, Won-Deok, CHOI, Byoung-Jun, KIM, Heon-Do, LEE, Won-Jun, RHA, Sa-Kyun, CHONG OOK PARK

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High-purity Ni electroless plating on screen-printed anodized Al substrates von Park, Sang-Geon, Lee, Youn-Seoung, Rha, Sa-Kyun

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Dilute H2SO4 solution for copper seed cleaning in electroplating von LEE, Youn-Seoung, YOON, Jae-Sik, JO, Yang-Rae, LEE, Heesoo, RHA, Sa-Kyun

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Preparation of Ge-Sb-Te Thin Films by Tellurization of Ge-Sb Thin Film for Phase-Change Random-Access Memory Application von Han, Byeol, Kim, Yewon, Kim, Yu-Jin, Cho, Mann-Ho, Rha, Sa-Kyun, Lee, Won-Jun

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Structural and chemical stability of Ta–Si–N thin film between Si and Cu von Lee, Yoon-Jik, Suh, Bong-Seok, Rha, Sa-Kyun, Park, Chong-Ook

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Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS von Lee, Won-Jun, Lee, Youn-Seoung, Rha, Sa-Kyun, Lee, Yoon-Jik, Lim, Kwan-Yong, Chung, Yong-Duck, Whang, Chung-Nam

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The electrical properties of dielectric stacks of SiO2 and Al2O3 prepared by atomic layer deposition method von Han, Byeol, Lee, Seung-Won, Park, Kwangchol, Park, Chong-Ook, Rha, Sa-Kyun, Lee, Won-Jun

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Behavior of Boron Implanted into n-Si (100) by Low-Energy (2 keV) Ion Implantation for a Shallow Junction von Rha, Sa-Kyun, Lee, Youn-Seoung, Lee, Won-Jun, Jeon, Min-Seok, Song, Jun-Kwang, Lee, Myeung Hee

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The effect of Mg concentration and annealing temperature on the adhesion characteristics of Cu(Mg) films on glass substrates von Kang, Sung-Geun, Han, Byeol, Park, Hyung Suk, Kang, Sung-Kyu, Rha, Sa-Kyun, Lee, Suk-Jae, Schlott, Martin, Lee, Won-Jun

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Characteristics of silicon oxide thin films prepared by sol electrophoretic deposition method using tetraethylorthosilicate as the precursor von Rha, Sa-Kyun, Chou, Tammy P., Cao, Guozhong, Lee, Youn-Seoung, Lee, Won-Jun

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Effect of Underlayer on the Via Filling and the Microstructure of the Aluminum Film in Aluminum Plug Process von Lee, Won-Jun, Rha, Sa-Kyun

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Atomic Layer Deposition and Properties of Silicon Oxide Thin Films Using Alternating Exposures to SiH2Cl2 and O3 von Lee, Won-Jun, Han, Chang-Hee, Park, Jae-Kyun, Lee, Youn-Seoung, Rha, Sa-Kyun

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Study of Si3N4/SiO2/Si and SiO2/Si3N4/Si Multilayers by O and N K-Edge X-ray Absorption Spectroscopy von Lee, Youn-Seoung, Lee, Won-Jun, Kang, Sung-Kyu, Rha, Sa-Kyun

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Thermally Stable Tungsten Bit-line Process Flow for the Capacitor Over Bit-line-Type Dynamic Random-Access Memory von Lee, Won-Jun, Hong, Jeongeui, Rha, Sa-Kyun

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Characterization of Electroplated Cu Thin Films on Electron-Beam-Evaporated Cu Seed Layers von Song, Yoojin, Seo, Jung-Hye, Lee, Youn-Seoung, Ryu, Young-Ho, Hong, Kimin, Rha, Sa-Kyun

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Characteristics of Silicon Dioxide Film Deposited by Neutral Beam-Assisted Chemical Vapor Deposition von Im, Young, Lee, Jung Hee, Lee, Youn-Seoung, Lee, Won-Jun, Rha, Sa-Kyun

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Surface Pretreatments for Remove of Native Cu Oxide Layer von Ju, Hyunjin, Lee, Yong-Hyuk, Lee, Youn-Seoung, Rha, Sa-Kyun

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Anode Effects in Electroplated Cu Film von Lee, Yong-Hyuk, Ju, Hyunjin, Rha, Sa-Kyun, Lee, Seung-Hee, Lee, Youn-Seoung

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Characteristics of SiO2 Film Grown by Atomic Layer Deposition as the Gate Insulator of Low-Temperature Polysilicon Thin-Film Transistors von Cao, Guo Zhong, Rha, Sa Kyun, Lee, Won Jun, Chun, Min Ho, Cheong, Kwang Su, Park, Chong Ook, Park, Kwang Chol

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