Optical proximity communication using reflective mirrors von Zheng, Xuezhe, Cunningham, John E, Shubin, Ivan, Simons, John, Asghari, Mehdi, Feng, Dazeng, Lei, Hongbin, Zheng, Dawei, Liang, Hong, Kung, Cheng-chih, Luff, Jonathan, Sze, Theresa, Cohen, Danny, Krishnamoorthy, Ashok V

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Optical interconnects: out of the box forever? von Dawei Huang, Sze, T., Landin, A., Lytel, R., Davidson, H.L.

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Interconnect Technologies and Advanced Packaging for High Performance Computing von Shi, Jing, Sze, Theresa, Song, Deqiang, Huang, Dawei, Cunningham, John E.

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Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package : Advances in wafer level packaging von SZE, Theresa, POPOVIC, Darko, JING SHI, LAI, Yi-Shao, MITCHELL, James G, GUENIN, Bruce, TSAI, Tsung-Yueh, KAO, Chin-Li, GIERE, Matthew

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Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package von Sze, Theresa, Popovic, Darko, Shi, Jing, Lai, Yi-Shao, Mitchell, James G., Guenin, Bruce, Tsai, Tsung-Yueh, Kao, Chin-Li, Giere, Matthew

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Optical interconnections within modern high-performance computing systems von Lytel, R., Davidson, H.L., Nettleton, N., Sze, T.

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CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS von SZE, Theresa, RAJ, Kannan, HUANG, Dawei, MCELFRESH, David K, ANESHANSLEY, Nicholas E

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Chip assembly configuration with densely packed optical interconnects von SZE THERESA, MCELFRESH DAVID K, ANESHANSLEY NICHOLAS E, HUANG DAWEI, RAJ KANNAN

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CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS von HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA

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CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS von HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA

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CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS von HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA

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CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS von SZE THERESA, MCELFRESH DAVID K, ANESHANSLEY NICHOLAS E, HUANG DAWEI, RAJ KANNAN

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Direct chip powering and enhancement of proximity communication through Anisotropic Conductive adhesive chip-to-chip bonding von Jing Shi, Popovic, Darko, Nettleton, Nyles, Sze, Theresa, Douglas, David, Thacker, Hiren, Cunningham, John, Furuta, Kazutaka, Kojima, Ryoji, Hirose, Koichi, Hwang, Kuopin

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Chip assembly configuration with densely packed optical interconnects von HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA

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Chip package with plank stack of semiconductor dies von SHUBIN IVAN, POPOVIC DARKO R, SHI JING, SZE THERESA Y, GIERE MATTHEW D, HARADA JOHN A, GUENIN BRUCE M, DOUGLAS DAVID C

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CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES von SHUBIN IVAN, POPOVIC DARKO R, SHI JING, SZE THERESA Y, GIERE MATTHEW D, HARADA JOHN A, GUENIN BRUCE M, DOUGLAS DAVID C

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Optical interconnect von Lytel, Rick, Davidson, Howard, Sze, Theresa, Nettleton, Nyles, Huang, Dawei

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Optical interconnect von SZE THERESA, NETTLETON NYLES, DAVIDSON HOWARD, HUANG DAWEI, LYTEL RICK

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OPTICAL INTERCONNECT von LYTEL, RICK, DAVIDSON, HOWARD, NETTLETON, NYLES, HUANG, DAWEI, SZE, THERESA

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Chip assembly configuration with densely packed optical interconnects von HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA

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