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  1. 1
    Structure and method of fabricating three-dimensional (3d) metal-insulator-metal (mim) capacitor and resistor in semi-additive plating metal wiring

    Structure and method of fabricating three-dimensional (3d) metal-insulator-metal (mim) capacitor and resistor in semi-additive plating metal wiring von SEE, GUAN HUEI, TOH, CHIN HOCK, MORI, GLEN T, SUNDARRAJAN, ARVID

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  2. 2
    Methods for bonding substrates

    Methods for bonding substrates von LIANTO, PRAYUDI, SEE, GUAN HUEI, DAI, XUNDONG, THIRUNAVUKARASU, SRISKANTHARAJAH, SUNDARRAJAN, ARVID, FUNG, PETER KHAI MUM

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  3. 3
    Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring

    Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring von SEE, GUAN HUEI, TOH, CHIN HOCK, MORI, GLEN T, SUNDARRAJAN, ARVID

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  4. 4
    RESPUTTERED COPPER SEED LAYER

    RESPUTTERED COPPER SEED LAYER von SUNDARRAJAN ARVID, GOPALRAJA PRABURAM, TANG XIANMIN, LUBBEN DANIEL, FORSTER JOHN, LUO QIAN, FU XINYU, YU JICK, CHUNG HUA, WANG RONGJUN, GUNG TZA JING, SUBRAMANI ANANTHA, CAO JONG

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  5. 5
    Resputtered copper seed layer

    Resputtered copper seed layer von GUNG, TZA-JING, LUO, QIAN, FORSTER, JOHN, CAO, YONG, CHUNG, HUA, FU, XINYU, TANG, XIAN-MIN, WANG, RONGJUN, LUBBEN, DANIEL, SUBRAMANI, ANANTHA, YU, JICK, SUNDARRAJAN, ARVID, PRABURAM GOPALRAJA

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