Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies von Davis, W.R., Oh, E.C., Sule, A.M., Franzon, P.D.

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Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies : Nanocircuits and systems von RHETT DAVIS, W, EUN CHU OH, SULE, Ambarish M, FRANZON, Paul D

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An 8192-point fast fourier transform 3D-IC case study von Davis, W.R., Sule, A.M., Franzon, P.D.

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Demystifying 3D ICs: the pros and cons of going vertical von Davis, W.R., Wilson, J., Mick, S., Xu, J., Hua, H., Mineo, C., Sule, A.M., Steer, M., Franzon, P.D.

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Multi-parameter power minimization of synthesized datapaths von Rhett Davis, W., Sule, A.M., Hao Hua

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