Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size von Chen, Chuantong, Suganuma, Katsuaki

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Large-scale ceramic–metal joining by nano-grained Ag particles paste sintering in low-temperature pressure-less conditions von Chen, Chuantong, Suganuma, Katsuaki

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A Miniaturized Flexible Antenna Printed on a High Dielectric Constant Nanopaper Composite von Inui, Tetsuji, Koga, Hirotaka, Nogi, Masaya, Komoda, Natsuki, Suganuma, Katsuaki

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Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature von Chen, Chuantong, Choe, Chanyang, Kim, Dongjin, Suganuma, Katsuaki

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Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release von Chen, Chuantong, Suganuma, Katsuaki

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Fabrication of Silver Nanowire Transparent Electrodes at Room Temperature von Tokuno, Takehiro, Nogi, Masaya, Karakawa, Makoto, Jiu, Jinting, Nge, Thi Thi, Aso, Yoshio, Suganuma, Katsuaki

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Transparent, Conductive, and Printable Composites Consisting of TEMPO-Oxidized Nanocellulose and Carbon Nanotube von Koga, Hirotaka, Saito, Tsuguyuki, Kitaoka, Takuya, Nogi, Masaya, Suganuma, Katsuaki, Isogai, Akira

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Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light von Yang, Yang, Ding, Su, Araki, Teppei, Jiu, Jinting, Sugahara, Tohru, Wang, Jun, Vanfleteren, Jan, Sekitani, Tsuyoshi, Suganuma, Katsuaki

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High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates von Chen, Chuantong, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

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Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint von Kim, Dongjin, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

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In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste von Zhang, Hao, Gao, Yue, Jiu, Jinting, Suganuma, Katsuaki

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Ag particles for sinter bonding: Flakes or spheres? von Yeom, Jeyun, Nagao, Shijo, Chen, Chuantong, Sugahara, Tohru, Zhang, Hao, Choe, Chanyang, Li, Cai-Fu, Suganuma, Katsuaki

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Efficient assembly of high-performance reduced graphene oxide/silver nanowire transparent conductive film based on in situ light-induced reduction technology von Li, Lingying, Li, Wanli, Jiu, Jinting, Suganuma, Katsuaki

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Fast, scalable, and eco-friendly fabrication of an energy storage paper electrode von Koga, Hirotaka, Tonomura, Hidetsugu, Nogi, Masaya, Suganuma, Katsuaki, Nishina, Yuta

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Bonding technology based on solid porous Ag for large area chips von Chen, Chuantong, Noh, Seungjun, Zhang, Hao, Choe, Chanyang, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

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High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device von Zhang, Hao, Chen, Chuantong, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

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Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test von Liu, Yang, Chen, Chuantong, Kim, Dongjin, Zhang, Zheng, Long, Xu, Suganuma, Katsuaki

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Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less von Chen, Chuantong, Zhang, Zheng, Wang, Qian, Zhang, Bowen, Gao, Yue, Sasamura, Tetsuya, Oda, Yukinori, Ma, Ninshu, Suganuma, Katsuaki

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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere von Gao, Yue, Li, Wanli, Chen, Chuantong, Zhang, Hao, Jiu, Jinting, Li, Cai-Fu, Nagao, Shijo, Suganuma, Katsuaki

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Highly stretchable, electrically conductive textiles fabricated from silver nanowires and cupro fabrics using a simple dipping-drying method von Cui, Hui-Wang, Suganuma, Katsuaki, Uchida, Hiroshi

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