Design and optimization of pin fin heat sinks for low velocity applications von Shaukatullah, H., Storr, W.R., Hansen, B.J., Gaynes, M.A.

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Thermal enhancement of flip-chip packages with radial-finger-contact spring von Shaukatullah, H., Hansen, B.J., Storr, W.R., Andros, F.E.

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Design and optimization of pin fin heat sinks for low velocity applications von Shaukatullah, H., Storr, W.R., Hansen, B.J., Gaynes, M.A.

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Metal substrate having an IC chip and carrier mounting von WILSON, JAMES W, STORR, WAYNE R, MACQUARRIE, STEPHEN W

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Structure for removably attaching a heat sink to surface mount packages von GAYNES MICHAEL A, SHAUKATULLAH HUSSAIN, ANDROS FRANK E, STORR WAYNE R

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Method and apparatus for testing of integrated circuit chips von STORR, WAYNE R, MAYR, WOLFGANG, ANSCHEL, MORRIS, LAMB, CHARLES R, MARKOVICH, VOYA R, POWERS, TAMAR A, REYNOLDS, SCOTT D, PIERSON, MARK V, RENY, TIMOTHY S, INGRAHAM, ANTHONY P, MURPHY, RICHARD G, SAMMAKIA, BAHGAT G, LOWELL, MICHAEL D

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METHOD AND APPARATUS FOR TESTING OF INTEGRATED CIRCUIT CHIPS von ANSCHEL, MORRIS, LAMB, CHARLES R, RENY, TIMOTHY S, LOWELL, MICHAEL D, MURPHY, RICHARD G, PIERSON, MARK V, INGRAHAM, ANTHONY P, MARKOVICH, VOYA R, MAYR, WOLFGANG, REYNOLDS, SCOTT D, POWERS, TAMAR A, STORR, WAYNE R, SAMMAKIA, BAHGAT G

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HIGH MEMORY DENSITY PACKAGE von ANSCHEL, MORRIS, FUNARI, JOSEPH, SHOLTES, TAMAR A, LAMB, CHARLES R, DIBBLE, ERIC P, KRESGE, JOHN S, STORR, WAYNE R., JR, MURPHY, RICHARD G, REYNOLDS, SCOTT D, BARBOSA, JOSE A, SAMMAKIA, BAHGAT G

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