The effect of Ni on the kinetics of electroless Cu film deposition von Logan, Eric, Sharma, Tanu, Brüning, Frank, Zarwell, Sebastian, Steinhäuser, Edith, Bernhard, Tobias, Chen, Ning, Brüning, Ralf

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Potential low-cost palladium-alternatives for activating electroless copper deposition von Steinhaeuser, Edith

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Chemical "kick start" for the autocatalytic formaldehyde-free electroless copper plating process von Steinhäuser, Edith, Stamp, Lutz, Brandt, Lutz

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기판 표면의 플라즈마-처리 방법 von SCHULZE JOERG, BRUENING FRANK, DUENNEBEIL SEBASTIAN, STEINHAEUSER EDITH, ZARWELL SEBASTIAN

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Method for monitoring the total amount of sulphur containing compounds in a metal plating bath von STEINHAEUSER, EDITH, WENDELN, CHRISTIAN, GOTTSCHALK, KEVIN-SIGURT, NISHIKIDO, MAYUMI, ZARWELL, SEBASTIAN, KIRBS, ANDREAS

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MONITORING METHOD FOR TOTAL AMOUNT OF SULFUR-CONTAINING COMPOUND IN METAL PLATING BATH von ANDREAS KIRBS, EDITH STEINHAEUSER, SEBASTIAN ZARWELL, CHRISTIAN WENDELN, KEVIN SIGURT GOTTSCHALK, NISHIKIDO MAYUMI

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FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION von STEINHAEUSER, EDITH, NGUYEN, TANG CAM LAI, WIESE, STEFANIE, STAMP, LUTZ, ROESELER, SANDRA

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FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION von STEINHAEUSER, EDITH, NGUYEN, TANG CAM LAI, WIESE, STEFANIE, STAMP, LUTZ, ROESELER, SANDRA

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FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION von STEINHAEUSER, EDITH, NGUYEN, TANG, CAM, LAI, WIESE, STEFANIE, STAMP, LUTZ, ROESELER, SANDRA

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금속 도금 욕에서 황 함유 화합물의 총량을 모니터링하는 방법 von WENDELN CHRISTIAN, STEINHAEUSER EDITH, KIRBS ANDREAS, ZARWELL SEBASTIAN, GOTTSCHALK KEVIN SIGURT, NISHIKIDO MAYUMI

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Method for monitoring the total amount of sulphur containing compounds in a metal plating bath von STEINHAEUSER, EDITH, WENDELN, CHRISTIAN, GOTTSCHALK, KEVIN-SIGURT, NISHIKIDO, MAYUMI, ZARWELL, SEBASTIAN, KIRBS, ANDREAS

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METHOD FOR TREATMENT OF RECESSED STRUCTURES IN DIELECTRIC MATERIALS FOR SMEAR REMOVAL von WIESE STEFANIE, GREGORIADES LAURENCE JOHN, SCHIEMANN JULIA, STEINHAEUSER EDITH, STAMP LUTZ

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Method for treatment of recessed structures in dielectric materials for smear removal von STEINHAEUSER, EDITH, GREGORIADES, LAURENCE JOHN, WIESE, STEFANIE, STAMP, LUTZ, SCHIEMANN, JULIA

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FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION von ROESELER SANDRA, WIESE STEFANIE, NGUYEN TANG CAM LAI, STEINHAEUSER EDITH, STAMP LUTZ

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Formaldehyde-free electroless copper plating solution von STEINHAEUSER, EDITH, LAI, NGUYEN TANG CAM, WIESE, STEFANIE, STAMP, LUTZ, ROESELER, SANDRA

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