Stove exhaust system von Sridhar, Uppili, Uppili, Sudarsan, Uppili, Jalaja V

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A high-sensitivity ribbed and bossed pressure transducer von Johnson, Ralph H., Karbassi, Said, Sridhar, Uppili, Speldrich, Brian

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Practical integration of polymerase chain reaction amplification and electrophoretic analysis in microfluidic devices for genetic analysis von Rodriguez, Isabel, Lesaicherre, Marie, Tie, Yan, Zou, Quanbo, Yu, Chen, Singh, Janak, Meng, Lim T., Uppili, Sridhar, Li, Sam F. Y., Gopalakrishnakone, Ponnampalam, Selvanayagam, Zachariah E.

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Micro-assembled multi-chamber thermal cycler for low-cost reaction chip thermal multiplexing von Zou, Quanbo, Miao, Yubo, Chen, Yu, Sridhar, Uppili, Chong, Chong Ser, Chai, Taichong, Tie, Yan, Teh, Christina Hui Leng, Lim, Tit Meng, Heng, ChewKiat

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Miniaturized independently controllable multichamber thermal cycler von Quanbo Zou, Sridhar, U., Yu Chen, Singh, J.

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Controlling the morphology in metal loaded paste material von Ellul, Joseph P, Sridhar, Uppili, Davani, Nazanin

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Methods of forming coaxial feedthroughs for 3D integrated circuits von BERGEMONT ALBERT, SRIDHAR UPPILI

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A study on micromachined bimetallic actuation von Zou, Quanbo, Sridhar, Uppili, Lin, Rongming

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Methods of forming coaxial feedthroughs for 3D integrated circuits von BERGEMONT ALBERT, SRIDHAR UPPILI

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High rate deposition method of magnetic nanocomposites von ELLUL JOSEPH PAUL, SRIDHAR UPPILI

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Bonded stacked wafers and methods of electroplating bonded stacked wafers von YING XUEJUN, ZOU QUANBO, SRIDHAR UPPILI, KELKAR AMIT S

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Microrelays and microrelay fabrication and operating methods von Sridhar, Uppili, Zou, Quanbo

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Microrelays and microrelay fabrication and operating methods von ZOU QUANBO, SRIDHAR UPPILI

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WAFER LEVEL PACKAGING PROCESS von ZOU, QUANBO, SRIDHAR, UPPILI

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Wafer level packaging process von Sridhar, Uppili, Zou, Quanbo

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Wafer level packaging process von ZOU QUANBO, SRIDHAR UPPILI

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BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED WAFERS von YING XUEJUN, ZOU QUANBO, SRIDHAR UPPILI, KELKAR AMIT S

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Bonded stacked wafers and methods of electroplating bonded stacked wafers von YING XUEJUN, ZOU QUANBO, SRIDHAR UPPILI, KELKAR AMIT S

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WAFER LEVEL PACKAGING PROCESS von ZOU, QUANBO, SRIDHAR, UPPILI

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Extractor for chemical analysis of lipid biomarkers von Jahnke, Linda Louise, Wilhelm, Mary Beth, Anderson, Morgan James, Sridhar, Kanchana Uppili, Ricco, Antonio Joseph, Furlong, Padraig Michael, Buckner, Denise Kathleen

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