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  1. 1
    METHODS FOR BOW COMPENSATION USING TENSILE NITRIDE

    METHODS FOR BOW COMPENSATION USING TENSILE NITRIDE von Srivathanakul, Songkram Sonny, Bajaj, Gopal, Lee, Pin Hian, Collins, David H, Soedibyo, Rio, Gaire, Raman, Bae, Sanggil, Takahashi, Nobuyuki, Lazkani, Houssam

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  2. 2
    METHODS FOR BOW COMPENSATION USING TENSILE NITRIDE

    METHODS FOR BOW COMPENSATION USING TENSILE NITRIDE von BAE, Sanggil, SOEDIBYO, Rio, LAZKANI, Houssam, COLLINS, David H, BAJAJ, Gopal, SRIVATHANAKUL, Songkram Sonny, LEE, Pin Hian, TAKAHASHI, Nobuyuki, GAIRE, Raman

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  3. 3
    CONTACT CONSTRUCTION FOR SEMICONDUCTOR DEVICES WITH LOW-DIMENSIONAL MATERIALS

    CONTACT CONSTRUCTION FOR SEMICONDUCTOR DEVICES WITH LOW-DIMENSIONAL MATERIALS von Tang, Hao-Ling, Pakala, Mahendra, Hsiao, Yi-Hsuan, Conrad, Mark, Soedibyo, Rio, Yu, Minrui, Yang, Dongqing, Kumar, Arvind, Wong, Keith Tatseun

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  4. 4
    CONTACT CONSTRUCTION FOR SEMICONDUCTOR DEVICES WITH LOW-DIMENSIONAL MATERIALS

    CONTACT CONSTRUCTION FOR SEMICONDUCTOR DEVICES WITH LOW-DIMENSIONAL MATERIALS von HSIAO, Yi-Hsuan, SOEDIBYO, Rio, KUMAR, Arvind, WONG, Keith Tatseun, YANG, Dongqing, YU, Minrui, CONRAD, Mark, PAKALA, Mahendra, TANG, Hao-Ling

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