Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study von Siow, K. S, Lin, Y. T

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Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material von Siow, K. S., Chua, S. T.

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Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material von Siow, K. S., Chua, S. T.

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Mechanical properties of nanocrystalline copper and nickel von Siow, K. S., Tay, A. A. O., Oruganti, P.

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The synergistic effects of propargyl alcohol and potassium iodide on the inhibition of mild steel in 0.5 M sulfuric acid solution von Feng, Y., Siow, K.S., Teo, W.K., Hsieh, A.K.

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Influence of sintering environment on silver sintered on copper substrate von Siow, K. S., Chua, S. T., Beake, B. D., Zuruzi, A. S.

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Influence of Copper Substrate Roughness on the Growth of Intermetallic Compounds Layer in SAC305 Solder Joints von Atiqah, A., Rahim, R.A.A.A., Jalar, A., Siow, K. S.

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Mixed mode fracture toughness of lead–tin and tin–silver solder joints with nickel-plated substrate von Siow, K.S., Manoharan, M.

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Corrosion protection of copper by a self-assembled monolayer of alkanethiol von FENG, Y, TEO, W.-K, SIOW, K.-S, GAO, Z, TAN, K.-L, HSIEH, A. A.-K

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Influence of curing lights and modes on cross-link density of dental composites von Yap, Adrian U J, Soh, M S, Han, Tarian T S, Siow, K S

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The corrosion behaviour of copper in neutral tap water. Part I: Corrosion mechanisms von Feng, Y., Teo, W.-K., Siow, K.-S., Tan, K.-l., Hsieh, ]A.-K.

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Finite element modeling of nano porous sintered silver material using computed tomography images von Meyghani, B., Awang, M., Bokam, P., Plank, B., Heinzl, C., Siow, K. S.

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Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag.,... von Siow, K. S, Lin, Y. T

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Stress analysis of nano porous material using computed tomography images von Meyghani, B., Awang, M., Emamian, S., Plank, B., Heinzl, C., Siow, K.S.

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Elution of leachable components from composites after LED and halogen light irradiation von Yap, Adrian U J, Han, Varian T S, Soh, M S, Siow, K S

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Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C von Chua, S.T., Siow, K.S.

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Thermal performance of a phase change material on a nickel-plated surface von Nurmawati, M.H., Siow, K.S., Rasiah, I.J.

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The effectiveness of cure of LED and halogen curing lights at varying cavity depths von Soh, M S, Yap, Adrian U J, Siow, K S

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Effectiveness of composite cure associated with different curing modes of LED lights von Soh, M S, Yap, Adrian U J, Siow, K S

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Microemulsion Polymerization of Styrene for Obtaining High Ratios of Polystyrene/Surfactant von Xu, X. J, Chew, C. H, Siow, K. S, Wong, M. K, Gan, L. M

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