Deforestation as the Prominent Driver of the Intensifying Wildfire in Cambodia, Revealed through Geospatial Analysis von Sim, Min-Sung, Wee, Shi-Jun, Alcantara, Enner, Park, Edward

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Frequency Measurement Device With Reconfigurable Bandwidth and Resolution von Sim, Sung-min, Lee, Yeonsu, Llamas-Garro, Ignacio, Kim, Jung-Mu

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Frequency discriminator design phase formula with experimental verification for frequency measurement systems with uniform sub‐band resolution von Sim, Sung‐min, Lee, Yeonsu, Kim, Jiwon, Kang, Hye‐Lim, Llamas‐Garro, Ignacio, Kim, Jung‐Mu

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Real-Time Predicting the Low-Temperature Performance of WLTC-Based Lithium-Ion Battery Using an LSTM-PF Sequential Ensemble Model von Sim, Min-Sung, Kim, Do-Yoon, Yoon, Yong-Jin, Kang, Seok-Won, Baek, Jong Dae

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Feature Size Control by Layer-by-Layer Printing and Non-wettable Patterns for Inkjet Printing of Micro Metal Electrode von Sim, Sung-min, Lee, Sang-Ho, Cho, Kwan Hyun, Yu, Jun Ho

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Self-aligned bilayer inkjet printing process for reducing shadow area by auxiliary electrodes in OLED lighting von Sim, Sung-min, Yu, Jun Ho, Cho, Kwan-Hyun, Lee, Sang-Ho

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Fracture analysis of anodically bonded silicon substrates during the CMP process von Sim, Sung-min, Lee, Yeonsu, Kang, Hye-Lim, Hwang, Youngsuk, Park, Chi-Hyun, Llamas-Garro, Ignacio, Kim, Jung-Mu

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RF performance of ink-jet printed microstrip lines on rigid and flexible substrates von Sim, Sung-min, Lee, Yeonsu, Kang, Hye-Lim, Shin, Kwon-Yong, Lee, Sang-Ho, Kim, Jung-Mu

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Silicon MEMS acceleration switch with high reliability using hooked latch von Lee, Yeonsu, Sim, Sung-Min, Kim, Hyunseok, Kim, Yong-Kweon, Kim, Jung-Mu

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Flip chip bonding using ink-jet printing technology von Kang, Hye-Lim, Sim, Sung-min, Lee, Yeonsu, Yu, Jun Ho, Shin, Kwon-Yong, Lee, Sang-Ho, Kim, Jung-Mu

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A 50–100 GHz ohmic contact SPDT RF MEMS silicon switch with dual axis movement von Sim, Sung-min, Lee, Yeonsu, Jang, Yun-Ho, Lee, Yong-Seok, Kim, Yong-Kweon, Llamas-Garro, Ignacio, Kim, Jung-Mu

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Silicon-on-quartz bonding based SPR chip von Lee, Yeonsu, Sim, Sung-min, Fontana, Eduardo, Llamas-Garro, Ignacio, Cavalcanti, Gustavo Oliveira, Kim, Jung-Mu

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Transmission line printed using silver nanoparticle ink on FR-4 and polyimide substrates von Sim, Sung-min, Lee, Yeonsu, Kang, Hye-lim, Shin, Kwon-Yong, Lee, Sang-Ho, Kim, Jung-Mu

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Fracture strength measurement of silicon chips von LEE, S.-M, SIM, S.-M, CHUNG, Y.-W, JANG, Y.-K, CHO, H.-K

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A 50–100GHz ohmic contact SPDT RF MEMS silicon switch with dual axis movement von Sim, Sung-min, Lee, Yeonsu, Jang, Yun-Ho, Lee, Yong-Seok, Kim, Yong-Kweon, Llamas-Garro, Ignacio, Kim, Jung-Mu

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CONTINUOUS INSULATION FILM COATING METHOD FOR PARTIAL VERTICAL CORRUGATED THIN FLAT CABLE AND FOR PARTIAL VERTICAL CORRUGATED THIN FLAT CABLE PRODUCED THEREBY von YU JUN HO, LEE SANG HO, SIM SUNG MIN

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FLEXIBLE VERTICAL WRINKLE CIRCUIT AND THEIR MANUFACTURING METHOD von YU JUN HO, LEE SANG HO, SHIN KWON YONG, SIM SUNG MIN

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Method for Fabrication of micro wiring and method for Fabrication of Flexible Flat Cable using thereof von YU JUN HO, LEE SANG HO, SIM SUNG MIN

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SURFACE PLASMON RESONANCE MEASUREMENT APPARATUS BASED ON SOUND PRESUURE CAPABLE OF DETACHABLE ATTACHMENT AND METHOD OF SUBSTRATE DETACHMENT OR ATTACHMENT THEREOF von KIM JUNG MU, LEE YEONSU, LEE KOOK NYUNG, SIM SUNG MIN

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SYSTEM FOR MEASUREMENT RECONFIGURABLE RADIO FREQUENCY AND METHOD THEREOF von KIM, JUNG MU, SIM, SUNG MIN, KANG, HYE LIM, LEE, YEON SU

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