Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200 mm wafers von Pouydebasque, Arnaud, Bridoux, Claudine, Jacquet, Fabrice, Moreau, Stephane, Sage, Eric, Saint-Patrice, Damien, Bouvier, Christophe, Kopp, Christophe, Marchand, Gilles, Bolis, Sebastien, Sillon, Nicolas, Vigier-Blanc, Emmanuelle

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Micromachined mass spectrometer von Sillon, Nicolas, Baptist, Robert

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System on Wafer: A New Silicon Concept in SiP von Poupon, Gilles, Batude, Perrine, Sillon, Nicolas, Henry, David, Gillot, Charlotte, Mathewson, Alan, Di Cioccio, Lea, Charlet, Barbara, Leduc, Patrick, Vinet, Maud

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Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200mm wafers von Pouydebasque, Arnaud, Bridoux, Claudine, Jacquet, Fabrice, Moreau, Stéphane, Sage, Eric, Saint-Patrice, Damien, Bouvier, Christophe, Kopp, Christophe, Marchand, Gilles, Bolis, Sébastien, Sillon, Nicolas, Vigier-Blanc, Emmanuelle

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System-on-Wafer: 2-D and 3-D Technologies for Heterogeneous Systems von Souriau, Jean-Charles, Sillon, N, Brun, J, Boutry, H, Hilt, T, Henry, D, Poupon, G

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Electrical and morphological assessment of via middle and backside process technology for 3D integration von Colonna, J., Coudrain, P., Garnier, G., Chausse, P., Segaud, R., Aumont, C., Jouve, A., Hotellier, N., Frank, T., Brunet-Manquat, C., Cheramy, S., Sillon, N.

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System on Wafer: A New Silicon Concept in SiP : With this flexible, low-cost, high-yield packaging technique, which can be implemented by various technologies, components and chips... von POUPON, Gilles, SILLON, Nicolas, HENRY, David, GILLOT, Charlotte, MATHEWSON, Alan, DI CIOCCIO, Lea, CHARLET, Barbara, LEDUC, Patrick, VINET, Maud, BATUDE, Perrine

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Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking von Cadix, Lionel, Fuchs, Christine, Rousseau, Maxime, Leduc, Patrick, Chaabouni, Hamed, Thuaire, Aurelie, Brocard, Melanie, Valentian, Alexandre, Farcy, Alexis, Bermond, Cedric, Sillon, Nicolas, Ancey, Pascal, Fléchet, Bernard

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Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200 mm wafers von Pouydebasque, Arnaud, Bridoux, Claudine, Jacquet, Fabrice, Moreau, Stéphane, Saint-Patrice, Damien, Bouvier, Christophe, Kopp, Christophe, Marchand, Gilles, Bolis, Sébastien, Sillon, Nicolas, Vigier-Blanc, Emmanuelle

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METHOD OF FABRICATING A DEVICE COMPRISING AN ENCAPSULATED MICROSYSTEM von LAGOUTTE, Emmanuelle, SILLON, Nicolas, GILLOT, Charlotte

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3D Integration Technology Activities at CEA-LETI Minatec von Scannell, Mark, Poupon, Gilles, Di Cioccio, Lea, Henry, David, Souriau, Jean-Charles, Grossi, Francois, Leduc, Patrick, Battude, Perrine, Vinnet, Maud, Guegen, Pierric, Clavalier, Laurent, Sillon, Nicolas

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Objects assembly through a sealing bead including intermetallic compounds von BAILLIN XAVIER, SILLON NICOLAS, SIBUET HENRI

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PRODUCTION OF CAVITIES THAT CAN BE FILLED WITH A FLUID MATERIAL IN AN OPTICAL MICROTECHNOLOGICAL COMPONENT von SOURIAU, JEANARLES, JOLY, JEAN-PIERRE, SILLON, NICOLAS

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Device for connecting nano-objects to external electrical systems, and method for manufacturing the device von BAILLIN, XAVIER, SILLON, NICOLAS, THUAIRE, AURÉLIE

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Assembly of objects by means of a sealing bead comprising intermetallic compounds von BAILLIN, XAVIER, SIBUET, HENRI, SILLON, NICOLAS

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Device for connecting nano-objects to external electrical systems, and method for producing said device von BAILLIN XAVIER, THUAIRE AURELIE, SILLON NICOLAS

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LÉTI’S TWO STEP APPROACH IN THE DOMAIN OF 3D INTEGRATION von Rouzaud, André, Sillon, Nicolas, Scannell, Mark, Henry, David, Mourier, T.

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Production of cavities that can be filled with a fluid material in an optical microtechnological component von SILLON NICOLAS, JOLY JEAN-PIERRE, SOURIAU JEANARLES

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DEVICE FOR CONNECTING NANO-OBJECTS TO EXTERNAL ELECTRICAL SYSTEMS, AND METHOD FOR PRODUCING SAID DEVICE von BAILLIN XAVIER, THUAIRE AURELIE, SILLON NICOLAS

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OBJECTS ASSEMBLY THROUGH A SEALING BEAD INCLUDING INTERMETALLIC COMPOUNDS von BAILLIN XAVIER, SILLON NICOLAS, SIBUET HENRI

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