Direct Organometallic Synthesis:  The Metal-Etching Reactions of Isobutyl Iodide on Al(111)1 von Lohokare, Shrikant P, Crane, Elizabeth L, Dubois, Lawrence H, Nuzzo, Ralph G

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Reactions of Disilane on Cu(111): Direct Observation of Competitive Dissociation, Disproportionation, and Thin Film Growth Processes von Lohokare, Shrikant P, Wiegand, Benjamin C, Nuzzo, Ralph G

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Silicon-hydrogen (Si-H) bond activation on copper: reaction of silane on Cu(111) von Wiegand, Benjamin C, Lohokare, Shrikant P, Nuzzo, Ralph G

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Collision-induced activation of the β-hydride elimination reaction of isobutyl iodide dissociatively chemisorbed on Al(111) von Lohokare, Shrikant P., Crane, Elizabeth L., Dubois, Lawrence H., Nuzzo, Ralph G.

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Direct organometallic synthesis : The metal-etching reactions of isobutyl iodide on Al(111) von LOHOKARE, S. P, CRANE, E. L, DUBOIS, L. H, NUZZO, R. G

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Method for stress free conductor removal von ANDREW D. BAILEY III, SHRIKANT P. LOHOKARE

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METHODS AND ARRANGEMENT FOR REDUCTION OF BY-PRODUCT DEPOSITION IN PLASMA PROCESSING SYSTEM von LOHOKARE SHRIKANT P, BAILLY ANDREW D III

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METHOD FOR STRESS FREE CONDUCTOR REMOVAL von ANDREW D. BAILEY III, SHRIKANT P. LOHOKARE

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METHOD FOR PASSIVATING AN EXPOSED CONDUCTIVE MATERIAL von ANDREW D. BAILEY, III, SHRIKANT P. LOHOKARE

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Method for stress free conductor removal von BAILEY, III ANDREW D, LOHOKARE SHRIKANT P

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Method for stress free conductor removal von Bailey, III, Andrew D, Lohokare, Shrikant P

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Methods and arrangement for the reduction of byproduct deposition in a plasma processing system von Lohokare, Shrikant P, Bailey, III, Andrew D

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Methods and arrangement for the reduction of byproduct deposition in a plasma processing system von BAILEY, III ANDREW D, LOHOKARE SHRIKANT P

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Si-H bond activation on Cu : reaction of silane on Cu(111) von WIEGAND, B. C, LOHOKARE, S. P, NUZZO, R. G

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Methods and arrangement for the reduction of byproduct deposition in a plasma processing system von BAILEY, III, LOHOKARE, SHRIKANT P

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METHODS AND ARRANGEMENT FOR THE REDUCTION OF BYPRODUCT DEPOSITION IN A PLASMA PROCESSING SYSTEM von BAILEY, ANDREW, D, III, LOHOKARE, SHRIKANT, P

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METHODS AND ARRANGEMENT FOR THE REDUCTION OF BYPRODUCT DEPOSITION IN A PLASMA PROCESSING SYSTEM von BAILEY, ANDREW, D, III, LOHOKARE, SHRIKANT, P

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System and method for surface reduction, passivation, corrosion prevention and activation of copper surface von BAILEY, ANDREW D. III, LOHOKARE, SHRIKANT P

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METHODS AND ARRANGEMENT FOR THE REDUCTION OF BYPRODUCT DEPOSITION IN A PLASMA PROCESSING SYSTEM von LOHOKARE SHRIKANT P, BAILEY ANDREW D III

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System and method for stress free conductor removal von LOHOKARE SHRIKANT P, BAILEY ANDREW D.III

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