Application of X-ray Computed Tomography to Measuring Fiber Orientation Distribution of Chopped Carbon Fiber Tape Reinforced Thermoplastics von Cai, Guangbin, Shirai, Takehiro, Wan, Yi, Uzawa, Kiyoshi, Takahashi, Jun

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Guided wave and damage detection in composite laminates using different fiber optic sensors von Li, Fucai, Murayama, Hideaki, Kageyama, Kazuro, Shirai, Takehiro

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Infrared-thermography measurement of temperature distribution in carbon fiber–reinforced polypropylene during ultrasonic welding von Kawasaki, Shota, Naito, Kimiyoshi, Ishida, Osuke, Shirai, Takehiro, Uzawa, Kiyoshi

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A fiber optic Doppler sensor and its application in debonding detection for composite structures von Li, Fucai, Murayama, Hideaki, Kageyama, Kazuro, Meng, Guang, Ohsawa, Isamu, Shirai, Takehiro

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Analysis of Fiber Orientation and a Simulation of Damage Fracture Prediction Using an X-ray Phase Imaging Method for Discontinuous Carbon Fiber Random Laminated Molded Products von SHIRAI, Takehiro, SAKAGUCHI, Mami, UZAWA, Kiyoshi, DOKI, Takahiro, MORIMOTO, Naoki, KIMURA, Kenji, KOH, Shomei

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Doppler effect-based fiber-optic sensor and its application in ultrasonic detection von Li, Fucai, Murayama, Hideaki, Kageyama, Kazuro, Shirai, Takehiro

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Debonding detection using a self-calibration sensor network von Li, Fucai, Murayama, Hideaki, Kageyama, Kazuro, Meng, Guang, Ohsawa, Isamu, Shirai, Takehiro

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OPTICAL MODULE, COMPRISING PRINTED WIRING BOARD, LEAD FRAME AND MULTI-CHANNEL OPTICAL SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SAME von SHIRAI, Takehiro, IWASE, Masayuki

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不連続炭素繊維ランダム積層成形品のX線位相イメージング法による繊維配向解析と破壊挙動予測シミュレーションの検討 von 白井, 武広, 坂口, 真実, 鵜澤, 潔, 土岐, 貴弘, 森本, 直樹, 木村, 健士, 黄, 緒明

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CONVEYING DEVICE AND THERMOFORMING DEVICE von TERAMOTO KAZUNORI, SHIRAI TAKEHIRO

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Direct current to 34.1-Gb/s, 19-Gb/s/cm(3) low-jitter parallel optical interconnecting module for high-speed memory test systems von Okayasu, T, Watanabe, D, Ono, A, Shibata, M, Hayase, Y, Shirai, T, Inoue, T, Ueno, K, Hosoi, F, Akiyama, T

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Direct current to 34.1-Gb/s, 19-Gb/s/cm3 low-jitter parallel optical interconnecting module for high-speed memory test systems: Special Issue on Optical Interconnects von OKAYASU, Toshiyuki, WATANABE, Daisuke, ONO, Atsushi, SHIBATA, Masashi, HAYASE, Yusuke, SHIRAI, Takehiro, INOUE, Tomotaka, UENO, Kenji, HOSOI, Fumiki, AKIYAMA, Tsutomu

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Method of manufacturing a printed wiring board lead frame package von Shirai, Takehiro, Iwase, Masayuki

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Method of manufacturing a printed wiring board lead frame package von IWASE MASAYUKI, SHIRAI TAKEHIRO

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PRINT CHARGING MANAGEMENT SYSTEM, PRINT CHARGING MANAGEMENT METHOD, AND ITS PROGRAM von SHIRAI TAKEHIRO

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PRINTED WIRING BOARD, METHOD FOR MANUFACTURING SAME, LEAD FRAME PACKAGE AND OPTICAL MODULE von IWASE, MASAYUKI, SHIRAI, TAKEHIRO

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PRINTED WIRING BOARD, METHOD OF MANUFACTURING THE PRINTED WIRING BOARD, LEAD FRAME PACKAGE, AND OPTICAL MODULE von IWASE MASAYUKI, SHIRAI TAKEHIRO

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Miocene Benthonic Foraminif era from the Iwaf une Formation, Northern Niigata Prefecture von SHIRAI, Takehiro

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Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module von IWASE MASAYUKI, SHIRAI TAKEHIRO

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Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module von Shirai, Takehiro, Iwase, Masayuki

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