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  1. 1
    Resin composition for non-conductive film for 3D TSV encapsulation having excellent high temperature performance

    Resin composition for non-conductive film for 3D TSV encapsulation having excellent high temperature performance von SHIM KWAI CHI, BAI JIE, ZHANG, JUN, S, ZHUO QIZHUO

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  2. 2
    Resin composition for non-conductive film for 3D TSV encapsulation having excellent high temperature performance

    Resin composition for non-conductive film for 3D TSV encapsulation having excellent high temperature performance von SHIM KWAI CHI, BAI JIE, ZHANG, JUN, S, ZHUO QIZHUO

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    Patent

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