Use of biased-relay feedback for system identification von Shen, Shih-Haur, Wu, Jiun-Sheng, Yu, Cheng-Ching

Volltext

Use of relay-feedback test for automatic tuning of multivariable systems von Shen, Shih-Haur, Yu, Cheng-Ching

Volltext

Impact of Film Morphology on Chemical Mechanical Polishing of Tungsten von Xu, Kun, Shen, Shih-Haur, Fung, Jason, Iravani, Hassan, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Bogdan, Chang, Shou-Sung, Tu, Wen-chiang, Kitajima, Tomohiko, Mikhaylich, Katrina, Brown, Brian, Huey, Sidney, Redeker, Fritz

Volltext

Autotune Identification under Load Disturbance von Shen, Shih-Haur, Wu, Jiun-Sheng, Yu, Cheng-Ching

Volltext

Metal Clearing Process Control in Metal CMP von Xu, Kun, Carlsson, Ingemar, Liu, Tzu-Yu, Shen, Shih-Haur, Swedek, Bogdan, Wang, You, Xia, Xinyun, Bennett, Doyle, Tu, Wen-Chiang, Karuppiah, Lakshmanan

Volltext

Use of saturation-relay feedback for autotune identification von Shen, Shih-Haur, Hong-Den Yu, Yu, Cheng-Ching

Volltext

Derivation of transfer function from relay feedback systems von Chang, Ren Chiou, Shen, Shih Haur, Yu, Cheng Ching

Volltext

Multivariable control of multizone chemical mechanical polishing von Shiu, Sheng-Jyh, Yu, Cheng-Ching, Shen, Shih-Haur

Volltext

Planarization strategy of Cu CMP: Interaction between plated copper thickness and removal rate von CHIU, Jian-Bin, SU, An-Jhih, YU, Cheng-Ching, SHEN, Shih-Haur

Volltext

Operational aspects of chemical mechanical polishing: Polish pad profile optimization von CHEN, Cheng-Yu, YU, Cheng-Ching, SHEN, Shih-Haur, HO, Melissa

Volltext

Robust operation of copper chemical mechanical polishing von Kao, Yi-Chung, Yu, Cheng-Ching, Shen, Shih-Haur

Volltext

Batch Sequencing for Run-to-Run Control:  Application to Chemical Mechanical Polishing von Chen, Yih-Hang, Su, An-Jhih, Shiu, Sheng-Jyh, Yu, Cheng-Ching, Shen, Shih-Haur

Volltext

Selection of measurement locations for the control of rapid thermal processor von Huang, Chi-Jay, Yu, Cheng-Ching, Shen, Shih-Haur

Volltext

Application of soft landing to the process control of chemical mechanical polishing von Chiu, Jian-Bin, Yu, Cheng-Ching, Shen, Shih-Haur

Volltext

Selection of secondary measurement for parallel cascade control von Shen, Shih-Haur, Yu, Cheng-Ching

Volltext

Indirect feedforward control: multivariable systems von Shen, Shih-Haur, Yu, Cheng-Ching

Volltext

Autotune identification for systems with right-half-plane poles and zeros von Shen, Shih-Haur, Yu, Hong-Den, Yu, Cheng-Ching

Volltext

CMP TEMPERATURE AND SLURRY FLOW RATE CONTROL IN CMP von SOUNDARARAJAN HARI, BROWN BRIAN J, TANG JIANSHE, CHANG, SHOU SUNG, WU HAOSHENG, SHEN SHIH HAUR

Volltext bestellen

CORE CONFIGURATION FOR IN-SITU ELECTROMAGNETIC INDUCTION MONITORING SYSTEM von SWEDEK BOGUSLAW A, IRAVANI HASSAN G, IVANOV DENIS, XU KUN, SHEN SHIH HAUR

Volltext bestellen

POLISHING APPARATUS USING NEURAL NETWORK FOR MONITORING von SWEDEK BOGUSLAW A, IRAVANI HASSAN G, CHERIAN BENJAMIN, IVANOV DENIS, LEE HARRY Q, XU KUN, SHEN SHIH HAUR

Volltext bestellen