Design and implementation of a 700–2,600 MHz RF SiP module for micro base station von He, Yi, Liu, Fengman, Hou, Fengze, Wu, Peng, Li, Jun, Cao, Liqiang, Shangguan, Dongkai

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High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization von Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan

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Polymer-metal nano-composite films for thermal management von Carlberg, Björn, Wang, Teng, Liu, Johan, Shangguan, Dongkai

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Study of the Effect of No-Clean Flux Residue on Signal Integrity at High Frequency von Nguyen, Jennifer, Geiger, David, Xiao, Gangyao, Shangguan, Dongkai

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Evaluation of Launderability of Electrically Conductive Fabrics for E-Textile Applications von Liu, Weifeng, Shangguan, Dongkai, Lee, Jeffrey ChangBing

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Cellular Growth of Crystals von Shangguan, Dongkai

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Solidification and reliability of lead-free solder interconnection von Yu, Hao, Shangguan, Dongkai

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Investigation of the effect of solder flux residues on RF signal integrity using real circuits von Geiger, David, Shangguan, Dongkai

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Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester von Lu, Minfu, Qian, Zhengfang, Ren, Wei, Liu, Sheng, Shangguan, Dongkai

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Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint von Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan

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A study of SMT assembly processes for fine pitch CSP packages von Arra, Minna, Geiger, David, Shangguan, Dongkai, Sjöberg, Jonas

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Development of lead-free wave soldering process von Arra, M., Shangguan, D., Yi, S., Thalhammer, R., Fockenberger, H.

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Erratum to: Design and implementation of a 700–2,600 MHz RF SiP module for micro base station von He, Yi, Liu, Fengman, Hou, Fengze, Wu, Peng, Li, Jun, Cao, Liqiang, Shangguan, Dongkai

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Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering von Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan

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Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate von Sun, Peng, Andersson, Cristina, Wei, Xicheng, Cheng, Zhaonian, Shangguan, Dongkai, Liu, Johan

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Control of thermal interface material in multi-chip package von Yang, Cheng, Shangguan, Dongkai

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DEVICES, SYSTEMS, AND METHODS FOR STACKED DIE PACKAGES von Yang, Cheng, Shangguan, Dongkai

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A new 2.5D TSV package assembly approach von Yuan Lu, Wen Yin, Bo Zhang, Daquan Yu, Lixi Wan, Dongkai Shangguan, Guofeng Xia, Fei Qin, Mao Ru, Fei Xiao

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A new drop test vehicle for a uniform shock response von Dongji Xie, Geiger, David, Dongkai Shangguan, Hu, Billy, Werner, Bill

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Control of Thermal Interface Material in Multi-Chip Package von SHANGGUAN, Dongkai, YANG, Cheng

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