Genotoxicity Studies of Heavy Metals: Lead, Bismuth, Indium, Silver and Antimony von Asakura, Keiko, Satoh, Hiroshi, Chiba, Momoko, Okamoto, Masahide, Serizawa, Koji, Nakano, Makiko, Omae, Kazuyuki

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Oral Toxicity of Bismuth in Rat：Single and 28-Day Repeated Administration Studies von Sano, Yuri, Satoh, Hiroshi, Chiba, Momoko, Okamoto, Masahide, Serizawa, Koji, Nakashima, Hiroshi, Omae, Kazuyuki

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Some Propaties and Compositions of Lead-Free Solders von SERIZAWA, Koji

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Genotoxicity Studies of Heavy Metals von Asakura, Keiko, Satoh, Hiroshi, Chiba, Momoko, Okamoto, Masahide, Serizawa, Koji, Nakano, Makiko, Omae, Kazuyuki

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Oral Toxicity of Indium in Rats von Asakura, Keiko, Satoh, Hiroshi, Chiba, Momoko, Okamoto, Masahide, Serizawa, Koji, Nakano, Makiko, Omae, Kazuyuki

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Evaluation of Wettability for Outer Leads of Tape Carrier Package by Solder von SERIZAWA, Koji, MIURA, Kazumu, ISHIDA, Toshiharu, NAKAMURA, Shozo

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Oral Toxicity of Bismuth in Rat von Sano, Yuri, Satoh, Hiroshi, Chiba, Momoko, Okamoto, Masahide, Serizawa, Koji, Nakashima, Hiroshi, Omae, Kazuyuki

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Warop Deformation and Residual Stresses of Two Layered Laminated Bodies Consisted of Metal and Thermosetting Resin von NAKAMURA, Syozo, HASEBE, Akio, SERIZAWA, Koji, KOSAKA, Takashi, HARUTA, Ryo

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Electronic component with varying rigidity leads using Pb-free solder von NAKATSUKA TETSUYA, SERIZAWA KOJI

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DATA ERASING DEVICE von SERIZAWA KOJI

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MOUNTING STRUCTURE von NAKATSUKA TETSUYA, SERIZAWA KOJI

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MOUNTING STRUCTURE von NAKATSUKA TETSUYA, SERIZAWA KOJI

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Application of Lead Free Solders to Semiconductor Packages von SERIZAWA, Koji, MIURA, Kazuma, SHIMOKAWA, Hanae, NAKATSUKA, Tetsuya

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ELECTRONIC COMPONENT WITH LEAD USING LEAD-FREE SOLDERING von NAKATSUKA TETSUYA, SERIZAWA KOJI

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ELECTRONIC COMPONENT WITH LEAD USING PB-FREE SOLDER von NAKATSUKA TETSUYA, SERIZAWA KOJI

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EMERGENCY TRANSMITTER CARD von SERIZAWA KOJI

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INFORMATION PROCESSING SYSTEM von SERIZAWA KOJI

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PARKING TICKET ISSUER WITH MOVABLE DELIBERY PORT von SERIZAWA KOJI

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CIRCUIT BOARD STRUCTURE von OKUBO MASAFUMI, NAKATSUKA TETSUYA, SERIZAWA KOJI

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SOLDERING ELECTRODE STRUCTURE von SERIZAWA KOJI

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