Treffer 1 - 20 von 125 für Suche 'SCHLETZ, Andreas', Suchdauer: 0,65s Treffer weiter einschränken
  1. 1
    Extending the lifetime of power electronic assemblies by increased cooling temperatures

    Extending the lifetime of power electronic assemblies by increased cooling temperatures von Hutzler, Aaron, Tokarski, Adam, Schletz, Andreas


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  2. 2
    Partial Discharges in Ceramic Substrates - Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements

    Partial Discharges in Ceramic Substrates - Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements von Bayer, Christoph Friedrich, Waltrich, Uwe, Soueidan, Amal, Baer, Eberhard, Schletz, Andreas


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  3. 3
    Characteristics and aging of PCB embedded power electronics

    Characteristics and aging of PCB embedded power electronics von Randoll, Richard, Asef, Mahmud, Wondrak, Wolfgang, Böttcher, Lars, Schletz, Andreas


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  4. 4
    Silver Sintering of Packaged GaN-Devices on Printed Circuit Board

    Silver Sintering of Packaged GaN-Devices on Printed Circuit Board von Müller, Jonas, Letz, Sebastian A., Simon, Flaviu-Bogdan, Bayer, Christoph F., Schletz, Andreas, Görlich, Jens, Nishimura, Takatoshi


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  5. 5
    Electrical Properties of Schottky-Diodes Based on B Doped Diamond

    Electrical Properties of Schottky-Diodes Based on B Doped Diamond von Kirste, Lutz, Erlbacher, Tobias, Pinti, L., Zuerbig, Verena, Nebel, Christoph E., Frey, Lothar, Huerner, Andreas, Bauer, Anton J., Zhu, Yi Lin, Bach, Linh, Schletz, Andreas, Giese, Christian

    Veröffentlicht in Materials science forum

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  6. 6
    Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic Applications

    Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic Applications von Bach, Hoang Linh, Dirksen, Daniel, Blechinger, Christoph, Endres, Tobias Maximilian, Bayer, Christoph Friedrich, Schletz, Andreas, März, Martin


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  7. 7
    POWER MODULE WITH AN INTEGRATED ALUMINIUM SNUBBER CAPACITOR

    POWER MODULE WITH AN INTEGRATED ALUMINIUM SNUBBER CAPACITOR von SCHLETZ, Andreas, EBEL, Thomas

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  8. 8
    Optimization of Copper Top-Side Metallization for High Performance SiC-Devices

    Optimization of Copper Top-Side Metallization for High Performance SiC-Devices von Geinitz, Eckart, Schletz, Andreas, Behrens, Tim, Suenner, Thomas, Frey, Lothar

    Veröffentlicht in Materials science forum

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  9. 9
    Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology

    Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology von Ziesche, Steffen, Reinhardt, Kathrin, Varghese, Jobin, Manhica, Birgit, Schletz, Andreas

    Veröffentlicht in IMAPSource Proceedings

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  10. 10
    Testing Wide Band-Gap Devices II (Focus on Packaging): Presentation held at ECPE Online Tutorial "Wide-Bandgap User Training", 20.05.2021

    Testing Wide Band-Gap Devices II (Focus on Packaging): Presentation held at ECPE Online Tutorial "Wide-Bandgap User Training", 20.05.2021 von Schletz, Andreas

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  11. 11
    POWER MODULE WITH AN INTEGRATED ALUMINIUM SNUBBER CAPACITOR

    POWER MODULE WITH AN INTEGRATED ALUMINIUM SNUBBER CAPACITOR von Ebel, Thomas, Schletz, Andreas

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  12. 12
    Testing Wide Band-Gap Devices II (Focus on Packaging): Presentation held at ECPE Tutorial Wide-Bandgap User Training, 22.09.2020, Berlin

    Testing Wide Band-Gap Devices II (Focus on Packaging): Presentation held at ECPE Tutorial Wide-Bandgap User Training, 22.09.2020, Berlin von Schletz, Andreas

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  13. 13
    POWER MODULE WITH AN INTEGRATED ALUMINIUM SNUBBER CAPACITOR

    POWER MODULE WITH AN INTEGRATED ALUMINIUM SNUBBER CAPACITOR von SCHLETZ, Andreas, EBEL, Thomas

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  14. 14
    Testing Wide Band-Gap Devices II (Focus on Packaging): Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria

    Testing Wide Band-Gap Devices II (Focus on Packaging): Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria von Schletz, Andreas

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  15. 15
    POWER MODULE WITH AN INTEGRATED ALUMINIUM SNUBBER CAPACITOR

    POWER MODULE WITH AN INTEGRATED ALUMINIUM SNUBBER CAPACITOR von SCHLETZ, Andreas, EBEL, Thomas

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  16. 16
    Method for increasing the electrical functionality, and/or service life, of power electronic modules

    Method for increasing the electrical functionality, and/or service life, of power electronic modules von Bayer, Christoph Friedrich, Schletz, Andreas

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  17. 17
    Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out: Presentation held at Schweizer Electronic Power and Radar PCB Summit 27./28.06.2018

    Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out: Presentation held at Schweizer Electronic Power and Radar PCB Summit 27./28.06.2018 von Schletz, Andreas

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  18. 18
    Reliability assessment of sintered nano-silver die attachment for power semiconductors

    Reliability assessment of sintered nano-silver die attachment for power semiconductors von Knoerr, M, Kraft, S, Schletz, A

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  19. 19
    Power module with a unipolar semiconductor component for a long service life

    Power module with a unipolar semiconductor component for a long service life von Erlbacher, Tobias, Schletz, Andreas

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  20. 20
    POWER MODULE WITH A UNIPOLAR SEMICONDUCTOR COMPONENT FOR A LONG SERVICE LIFE

    POWER MODULE WITH A UNIPOLAR SEMICONDUCTOR COMPONENT FOR A LONG SERVICE LIFE von ERLBACHER, TOBIAS, SCHLETZ, ANDREAS

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