Effect of Pad Surface Micro-Texture on Tribological, Thermal and Kinetic Characterizations during Copper Chemical Mechanical Planarization von Han, Ruochen, Mu, Yan, Sampurno, Yasa, Zhuang, Yun, Philipossian, Ara

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Chemical Mechanical Planarization and Old Italian Violins von Philipossian, Ara, Sampurno, Yasa, Peckler, Lauren

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Slurry Injection Schemes on the Extent of Slurry Mixing and Availability during Chemical Mechanical Planarization von Bahr, Matthew, Sampurno, Yasa, Han, Ruochen, Philipossian, Ara

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Method for Ultra Rapid Determination of the Lubrication Mechanism in Chemical Mechanical Planarization von Han, Ruochen, Sampurno, Yasa, Theng, Siannie, Sudargho, Fransisca, Zhuang, Yun, Philipossian, Ara

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Characterization of CMP Slurries Using Densitometry and Refractive Index Measurements von Vazquez Bengochea, Leticia, Sampurno, Yasa, Kavaljer, Marcus, Johnston, Rob, Philipossian, Ara

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Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO2 Chemical Mechanical Planarization Performance von McAllister, Jeffrey, Stuffle, Calliandra, Sampurno, Yasa, Hetherington, Dale, Sierra Suarez, Jon, Borucki, Leonard, Philipossian, Ara

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Effect of temperature in titanium chemical mechanical planarization von Mu, Yan, Jiao, Yubo, Sampurno, Yasa, Zhuang, Yun, Theng, Siannie, Philipossian, Ara

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Tribological, Thermal and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes von Jiao, Yubo, Liao, Xiaoyan, Wu, Changhong, Theng, Siannie, Zhuang, Yun, Sampurno, Yasa, Goldstein, Michael, Philipossian, Ara

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Feasibility of real-time detection of abnormality in inter layer dielectric slurry during chemical mechanical planarization using frictional analysis von Sampurno, Yasa, Sudargho, Fransisca, Zhuang, Yun, Goldstein, Michael, Philipossian, Ara

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Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications von Sampurno, Yasa, Borucki, Leonard, Zhuang, Yun, Misra, Sudhanshu, Holland, Karey, Boning, Duane, Philipossian, Ara

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A Method for Direct Measurement of Substrate Temperature during Copper CMP von Sampurno, Yasa A, Borucki, Leonard, Zhuang, Yun, Boning, Duane, Philipossian, Ara

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Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultr... von Sun, Ting, Borucki, Len, Zhuang, Yun, Sampurno, Yasa, Sudargho, Fransisca, Wei, Xiaomin, Anjur, Sriram, Philipossian, Ara

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Determining instantaneous removal rates in metal chemical mechanical planarization von Philipossian, Ricky, Sampurno, Yasa, Philipossian, Ara

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End-Point Detection of Ta/TaN Chemical Mechanical Planarization via Forces Analysis von Sampurno, Yasa, Gu, Xun, Nemoto, Takenao, Zhuang, Yun, Teramoto, Akinobu, Philipossian, Ara, Ohmi, Tadahiro

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Fractional In Situ Pad Conditioning in Chemical Mechanical Planarization von Han, Ruochen, Sampurno, Yasa, Philipossian, Ara

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Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process von Jiao, Yubo, Sampurno, Yasa Adi, Zhuang, Yun, Wei, Xiaomin, Meled, Anand, Philipossian, Ara

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Feasibility of a Real-Time Method in Determine the Extent of Pad Break-In During Copper Chemical Mechanical Planarization von Han, Ruochen, Sampurno, Yasa, Philipossian, Ara

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Tribological, Thermal, Kinetic, and Pad Micro-Textural Studies Using Polyphenylene Sulfide Retaining Rings in Interlayer Dielectric Chemical Mechanical Planarization von Philipossian, Ara, Sampurno, Yasa, Tustin, Michael, Schranner, Anton

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Analysis of A Novel Slurry Injection System in Chemical Mechanical Planarization von Meled, Anand, Zhuang, Yun, Sampurno, Yasa Adi, Theng, Siannie, Jiao, Yubo, Borucki, Leonard, Philipossian, Ara

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Insights into the Tribological and Kinetic Attributes of Retaining Rings in Chemical Mechanical Planarization von Diaz, Gabriela, Sampurno, Yasa, Philipossian, Ara

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