Thermoelastic damping in micro-scale circular plate resonators von Sun, Yuxin, Saka, Masumi

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Morphology control of hybrid Cu–Cu2O nanostructures fabricated by electrochemical migration von Aoki, Toshinori, Li, Yuan, Saka, Masumi

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Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect von Kimura, Yasuhiro, Saka, Masumi

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Suitable passivation thickness on a metal line to prevent electromigration damage von Kimura, Yasuhiro, Ikadai, Hiroto, Nakakura, Teruki, Saka, Masumi

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Fabrication of large-scale Ag micro/nanostructures using electrochemical migration von Nakakura, Teruki, Saka, Masumi

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Controlling surface morphology of Sn thin-film to enhance cycling performance in lithium ion batteries von Li, Yuan, Matsuura, Ryo, Saka, Masumi

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Growth of Ag micro/nanoparticles using stress migration from multilayered metallic structure von Lu, Yebo, Li, Yuan, Saka, Masumi

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Simplified processes using conductive passivation film for the fabrication of Al micro-wires by electromigration von Kimura, Yasuhiro, Saka, Masumi

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Characterization of the electrical and thermal properties of a metallic thin-film line von Sasaki, Takahiro, Li, Yuan, Saka, Masumi

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Buried structure for increasing fabrication performance of micromaterial by electromigration von Kimura, Yasuhiro, Saka, Masumi

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Analysis of the temperature field near a corner composed of dissimilar metals subjected to a current flow von Saka, Masumi, Zhao, Xu

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Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders von Zhao, Xu, Saka, Masumi, Muraoka, Mikio, Yamashita, Mitsuo, Hokazono, Hiroaki

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Forming long Ag thin wires by using stress migration von Lu, Yebo, Li, Yuan, Saka, Masumi

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Influence of a hot and humid environment on thermal transport across the interface between a Ag thin-film line and a substrate von Li, Yuan, Noguchi, Kyohei, Saka, Masumi

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Diffusion–fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing von Ri, Shien, Saka, Masumi

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Theoretical consideration of electromigration damage around a right-angled corner in a passivated line composed of dissimilar metals von Saka, Masumi, Kimura, Yasuhiro, Zhao, Xu

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Controlling Ag whisker growth using very thin metallic films von Tohmyoh, H., Yasuda, M., Saka, Masumi

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Influence of local thermal dissipation on electromigration in an Al thin-film line von Li, Yuan, Lee, Hsin-Tzu, Saka, Masumi

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Rapid and mass growth of stress-induced nanowhiskers on the surfaces of evaporated polycrystalline Cu films von Saka, Masumi, Yamaya, Fumihiko, Tohmyoh, Hironori

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Growth of copper microflowers assisted by electromigration under a low current density and subsequent stress-induced migration von Zhao, Xu, Saka, Masumi

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