Four‐Dimensional Design Space of High‐Q Second‐Order Distributed Feedback Perovskite Lasers von Annavarapu, Nirav, Goldberg, Iakov, Hamdad, Sarah, Elkhouly, Karim, Puybaret, Renaud, Sabuncuoglu Tezcan, Deniz, Genoe, Jan, Gehlhaar, Robert, Heremans, Paul

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Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform von Karve, Gauri, Li, Yunlong, Motsnyi, Vasyl, Wei, Wei, Visker, Jakob, Chancerel, François, Ackaert, Jan, Puybaret, Renaud, Dutta, Barundeb, Sabuncuoglu Tezcan, Deniz, Peng, Lan, Soussan, Philippe, Severi, Simone, Osman, Haris

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Micro vapor bubble jet flow for safe and high-rate fluorescence-activated cell sorting von de Wijs, Koen, Liu, Chengxun, Dusa, Alexandra, Vercruysse, Dries, Majeed, Bivragh, Tezcan, Deniz Sabuncuoglu, Blaszkiewicz, Kamil, Loo, Josine, Lagae, Liesbet

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Low-cost uncooled infrared detectors in CMOS process von Eminoglu, Selim, Tezcan, Deniz Sabuncuoglu, Tanrikulu, M.Yusuf, Akin, Tayfun

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First Demonstration of Hybrid CMOS Imagers With Simultaneous Very Low Crosstalk and High-Broadband Quantum Efficiency von Minoglou, K., De Munck, K., De Vos, J., Tezcan, D. S., Van Hoof, C., De Moor, P.

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3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias von Civale, Y, Tezcan, D S, Philipsen, H G G, Duval, F F C, Jaenen, P, Travaly, Y, Soussan, P, Swinnen, B, Beyne, E

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On the processing aspects of high performance hybrid backside illuminated CMOS imagers von De Vos, Joeri, De Munck, Koen, Minoglou, Kiki, Rao, Padmakumar Ramachandra, Erismis, Mehmet Akif, De Moor, Piet, Tezcan, Deniz Sabuncuoglu

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ESH Friendly Solvent for Stripping Positive and Negative Photoresists in 3D-Wafer Level Packaging and 3D-Stacked IC Applications von Suhard, Samuel, Claes, Martine, Travaly, Youssef, Civale, Yann, Sabuncuoglu Tezcan, Deniz, Nolmans, Philip

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Four-Dimensional Design Space of High-Q Second-Order Distributed Feedback Perovskite Lasers von Annavarapu, Nirav, Goldberg, Iakov, Hamdad, Sarah, Elkhouly, Karim, Puybaret, Renaud, Sabuncuoglu Tezcan, Deniz, Genoe, Jan, Gehlhaar, Robert, Heremans, Paul

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(Invited) Through-Silicon Via Technology for 3D Applications von Philipsen, Harold G., Lühn, Ole, Civale, Yann, Wang, Yu-Shuen, Sabuncuoglu Tezcan, Deniz, Ruythooren, Wouter

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Micro vapor bubble jet flow for safe and high-rate fluorescence-activated cell sortingElectronic supplementary information (ESI) available. See DOI: 10.1039/c6lc01560c von de Wijs, Koen, Liu, Chengxun, Dusa, Alexandra, Vercruysse, Dries, Majeed, Bivragh, Tezcan, Deniz Sabuncuoglu, Blaszkiewicz, Kamil, Loo, Josine, Lagae, Liesbet

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Micro vapor bubble jet flow for safe and high-rate fluorescence-activated cell sorting von De Wijs, Koen, Liu, Chengxun, Dusa, Alexandra, Vercruysse, Dries, Majeed, Bivragh, Tezcan, Deniz Sabuncuoglu, Blaszkiewicz, Kamil, Loo, Josine, Lagae, Liesbet

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Highly Selective Color Filters Based on Hybrid Plasmonic–Dielectric Nanostructures von De Proft, Anabel, Lodewijks, Kristof, Figeys, Bruno, Kouznetsov, Dmitry, Verellen, Niels, Pham, Nga P, Vereecke, Bart, Sabuncuoglu Tezcan, Deniz, Jansen, Roelof, Van Dorpe, Pol, Rottenberg, Xavier

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Fabrication of a CMOS-based Imaging Chip with Monolithically Integrated RGB and NIR Filters von Bart Vereecke, Els Van Besien, Deniz Sabuncuoglu Tezcan, Nick Spooren, Nicolaas Tack, Andy Lambrechts

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Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization von Cavaco, Celso, Peng, Lan, Lavizzari, Simone, Claes, Jesse, Hoovels, Nele V., Guerrieri, Stefano, Tezcan, Deniz Sabuncuoglu, Osman, Haris

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The RELAXd project: Development of four-side tilable photon-counting imagers von Vykydal, Zdenek, Visschers, Jan, Tezcan, Deniz Sabuncuoglu, De Munck, Koen, Borgers, Tom, Ruythooren, Wouter, De Moor, Piet

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A low-cost uncooled infrared microbolometer detector in standard CMOS technology von Tezcan, D.S., Eminoglu, S., Akin, T.

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On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes von Cavaco, Celso, Peng, Lan, Sebaai, Farid, Verbinnen, Greet, Visker, Jakob, Olmen, Jan, Tezcan, Deniz Sabuncuoglu, Osman, Haris

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Through-silicon via and die stacking technologies for microsystems-integration von Beyne, E., De Moor, P., Ruythooren, W., Labie, R., Jourdain, A., Tilmans, H., Tezcan, D.S., Soussan, P., Swinnen, B., Cartuyvels, R.

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Wafer Scale Processing of Plasmonic Nanoslit Arrays in 200mm CMOS Fab Environment von Malachowski, Karl, Verbeeck, Rita, Dupont, Tania, Chen, Chang, Li, Yi, Musa, Silke, Stakenborg, Tim, Sabuncuoglu Tezcan, Deniz, Van Dorpe, Pol

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