Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections von Ma, Z. L., Belyakov, S. A., Sweatman, K., Nishimura, T., Gourlay, C. M.

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Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints von Xian, J. W., Belyakov, S. A., Gourlay, C. M.

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Nucleation and Growth of Tin in Pb-Free Solder Joints von Gourlay, C. M., Belyakov, S. A., Ma, Z. L., Xian, J. W.

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Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4 von Belyakov, S.A., Gourlay, C.M.

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Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony von Belyakov, S. A., Coyle, R. J., Arfaei, B., Xian, J. W., Gourlay, C. M.

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Eutectic Morphology of Al-7Si-0.3Mg Alloys with Scandium Additions von Pandee, Phromphong, Gourlay, C. M., Belyakov, S. A., Ozaki, Ryota, Yasuda, Hideyuki, Limmaneevichitr, Chaowalit

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In situ imaging of microstructure formation in electronic interconnections von Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D., Nogita, K.

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Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints von Belyakov, S. A., Xian, J., Zeng, G., Sweatman, K., Nishimura, T., Akaiwa, T., Gourlay, C. M.

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The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints von Li, Z. Q., Belyakov, S. A., Xian, J. W., Gourlay, C. M.

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Nucleation of tin on the Cu6Sn5 layer in electronic interconnections von Xian, J.W., Ma, Z.L., Belyakov, S.A., Ollivier, M., Gourlay, C.M.

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AlSi2Sc2 intermetallic formation in Al-7Si-0.3Mg-xSc alloys and their effects on as-cast properties von Pandee, P., Gourlay, C.M., Belyakov, S.A., Patakham, U., Zeng, G., Limmaneevichitr, C.

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Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints von Belyakov, S.A., Xian, J.W., Sweatman, K., Nishimura, T., Akaiwa, T., Gourlay, C.M.

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Grain refinement of electronic solders: The potential of combining solute with nucleant particles von Shang, H., Ma, Z.L., Belyakov, S.A., Gourlay, C.M.

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Organizational and economic mechanisms of state management of technological development of industrial companies von Beliakov, G P, Ryzhaya, A A, Shpak, A S, Belyakov, S A

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Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates von Belyakov, S.A., Gourlay, C.M.

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NiSn4 formation during the solidification of Sn–Ni alloys von Belyakov, S.A., Gourlay, C.M.

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Novel Ni cermets for anode-supported proton ceramic fuel cells von Plekhanov, М. S., Lesnichyova, А. S., Stroeva, А. Yu, Ananyev, М. V., Farlenkov, А. S., Bogdanovich, N. М., Belyakov, S. A., Kuzmin, А. V.

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Effect of Chromium Oxide Additions on the Stability of Glass Ceramic Sealants for Solid Oxide Fuel Cells von Krainova, D. A., Saetova, N. S., Farlenkov, A. S., Belyakov, S. A., Kuz’min, A. V.

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Effect of mechanical activation procedure on the phase composition of gypsum von Kosenko, N. F., Belyakov, A. S., Smirnova, M. A.

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Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification von Xian, J.W., Yasuda, Hideyuki, Nogita, Kazuhiro, Zeng, G., Gourlay, Christopher M., Belyakov, S.A., Mohd Salleh, Mohd Arif Anuar

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