INCOBAT: Innovative Cost Efficient Management System for Next Generation High Voltage Batteries von Armengaud, Eric, Groppo, Riccardo, Rzepka, Sven

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On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers von Roshanghias, Ali, Dreissigacker, Marc, Scherf, Christina, Bretthauer, Christian, Rauter, Lukas, Zikulnig, Johanna, Braun, Tanja, Becker, Karl-F., Rzepka, Sven, Schneider-Ramelow, Martin

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Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy von Bayat, Parisa, Vogel, Dietmar, Rodriguez, Raul D., Sheremet, Evgeniya, Zahn, Dietrich R.T., Rzepka, Sven, Michel, Bernd

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Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques von Auersperg Jürgen, Vogel, Dietmar, Auerswald, Ellen, Rzepka Sven, Michel, Bernd

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Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor von Riegel, Daniel, Gromala, Przemyslaw Jakub, Rzepka, Sven

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Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices von Otto, Alexander, Rzepka, Sven, Wunderle, Bernhard

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Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches von Rzepka, Sven, Otto, Alexander, Vogel, Dietmar, Dudek, Rainer

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Reliability testing of integrated low-temperature PVD PZT films von Monteiro Diniz Reis, Daniel, Rzepka, Sven, Hiller, Karla

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An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages von Poshtan, Emad A., Rzepka, Sven, Silber, Christian, Wunderle, Bernhard

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INCOBAT von Armengaud, Eric

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Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation von Brueckner, John, Dehé, Alfons, Auerswald, Ellen, Dudek, Rainer, Vogel, Dietmar, Michel, Bernd, Rzepka, Sven

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Smart Features Integrated for Prognostics Health Management Assure the Functional Safety of the Electronics Systems at the High Level Required in Fully Automated Vehicles von Rzepka, Sven, Gromala, Przemyslaw J.

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The effects of underfill on the reliability of flip chip solder joints von PENG SU, RZEPKA, S, KORHONEN, M, LI, C. Y

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Characterization of partial discharge performance of die attach adhesives von Schaller, Rainer, Strutz, Volker, Theuss, Horst, Dudek, Rainer, Rzepka, Sven

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Technologies for the integration of miniaturised silicon sensor systems in fibre-reinforced composites von Arnold, Benjamin, Decker, Ricardo, Rost, Florian, Bauer, Angelika, Mehner, Jan, Kroll, Lothar, Rzepka, Sven, Otto, Thomas

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Affordable and Safe High Performance Vehicle Computers with Ultra-Fast On-Board Ethernet for Automated Driving von Hager, Martin, Gromala, Przemyslaw, Wunderle, Bernhard, Rzepka, Sven

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Smart Systems Integration 2021. Proceedings: International Conference and Exhibition on Smart Systems Integration, April 27-29, 2021, Online Conference von Otto, Thomas, Rzepka, Sven

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Reliability investigations for high temperature interconnects von Dudek, Rainer, Sommer, Peter, Fix, Andreas, Trodler, Joerg, Rzepka, Sven, Michel, Bernd

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Integrated Investigation Approach for Determining Mechanical Properties of Poly-silicon Membranes von Brueckner, John, Dehé, Alfons, Auerswald, Ellen, Dudek, Rainer, Michel, Bernd, Rzepka, Sven

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Investigation of Uncertainty Sources of Piezoresistive Silicon Based Stress Sensor von Gromala, Przemyslaw, Mayer, Dirk, Kreyßig, Kerstin, Rzepka, Sven, Palczynska, Alicja, Schindler-Saefkow, Florian, Melz, Tobias

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