Tailoring capping layers to reduce stress gradients in copper metallization von Murray, Conal E., Priyadarshini, Deepika, Nguyen, Son, Ryan, E. Todd

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Mechanical and Dielectric Properties of Pure-Silica-Zeolite Low-k Materials von Li, Zijian, Johnson, Mark C., Sun, Minwei, Ryan, E. Todd, Earl, David J., Maichen, Wolfgang, Martin, Jeremy I., Li, Shuang, Lew, Christopher M., Wang, Junlan, Deem, Michael W., Davis, Mark E., Yan, Yushan

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Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects von Todd Ryan, E., Gates, Stephen M., Cohen, Stephan A., Ostrovski, Yuri, Adams, Ed, Virwani, Kumar, Grill, Alfred

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Mitigating residual stress in Cu metallization von Murray, Conal E., Jordan-Sweet, Jean, Todd Ryan, E., Toney, Michael F.

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Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art von Grill, Alfred, Gates, Stephen M., Ryan, Todd E., Nguyen, Son V., Priyadarshini, Deepika

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Effect of low temperature anneals and nonthermal treatments on the properties of gap fill oxides used in SiGe and III-V devices von Ryan, E. Todd, Morin, Pierre, Madan, Anita, Mehta, Sanjay

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Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications von Zin, Emil H., Bang, W. H., Todd Ryan, E., King, Sean W., Kim, Choong-Un

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Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage von Ryan, E. Todd, Gates, Stephen M., Grill, Alfred, Molis, Steven, Flaitz, Philip, Arnold, John, Sankarapandian, Muthumanickam, Cohen, Stephan A., Ostrovski, Yuri, Dimitrakopoulos, Christos

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Stress determination through diffraction: establishing the link between Kröner and Voigt/Reuss limits von Murray, Conal E., Jordan-Sweet, Jean L., Bedell, Stephen W., Ryan, E. Todd

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Properties of nanoporous silica thin films determined by high-resolution x-ray reflectivity and small-angle neutron scattering von Wu, Wen-li, Wallace, William E., Lin, Eric K., Lynn, Gary W., Glinka, Charles J., Ryan, E. Todd, Ho, Huei-Min

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Evaluation of Pore Structure in Pure Silica Zeolite MFI Low-k Thin Films Using Positronium Annihilation Lifetime Spectroscopy von Li, Shuang, Sun, Jianing, Li, Zijian, Peng, Huagen, Gidley, David, Ryan, E. Todd, Yan

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A plasmaless, photochemical etch process for porous organosilicate glass films von Ryan, E. Todd, Molis, Steven E.

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A plasmaless, photochemical etch process for porous organosilicate glassfilms von Todd, Ryan E, Molis, Steven E

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Understanding stress gradients in microelectronic metallization von Murray, Conal E., Ryan, E. Todd, Besser, Paul R., Witt, Christian, Jordan-Sweet, Jean L., Toney, Michael F.

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Development of Voltammetry-Based Techniques for Characterization of Porous Low-k/Cu Interconnect Integration Reliability von Kim, Choong-Un, Chen, LiangShan, Michael, Nancy, Bang, Woong Ho, Park, Young-Joon, Ryan, Todd E., King, Sean

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Absorption and Fluorescence Studies of Acridine in Subcritical and Supercritical Water von Ryan, E. Todd, Xiang, Tao, Johnston, Keith P, Fox, Marye Anne

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Tailoring dielectric materials for robust BEOL reliability von Bonilla, G., Shaw, T. M., Liniger, E. G., Cohen, S., Gates, S. M., Grill, A., Shobha, H., Penny, C. J., Ryan, E. T.

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Weighted mechanical models for residual stress determination using x-ray diffraction von Murray, Conal E., Bedell, Stephen W., Ryan, E. Todd

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Materials Issues and Characterization of Low-k Dielectric Materials von Ryan, E. Todd, McKerrow, Andrew J., Leu, Jihperng, Ho, Paul S.

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Silane Decomposition on Cu Interconnects Inhibited by Ammonia von Ryan, E. Todd, Molis, Steven, Grill, Alfred

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