Design and Fabrication of an Ingestible Rechargeable Capsule for Thermal Monitoring von Lesho, J.C, Romenesko, B.M, Hogrefe, A.F

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Steady-state thermal conductivity measurements of AlN and SiC substrate materials von Dettmer, E.S., Romenesko, B.M., Charles, H.K., Carkhuff, B.G., Merrill, D.J.

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Gold-aluminum wirebond interface testing using laser-induced ultrasonic energy von Romenesko, B.M., Charles, H.K., Cristion, J.A., Siu, B.K.

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Leak rate measurement comparisons [package seals] von Romenesko, B.M., Ely, K.J.

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Metal electromigration induced by solder flux residue in hybrid microcircuits von Benson, R.C., Romenesko, B.M., Weiner, J.A., Nall, B.H., Charles, H.K.

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