Stress in electrodeposited CoFe alloy films von Shao, I., Romankiw, L.T., Bonhote, C.

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A path: from electroplating through lithographic masks in electronics to LIGA in MEMS von Romankiw, L.T.

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Electrodeposition of Gold on Silicon Nucleation and Growth Phenomena von Huang, Q., Deligianni, H., Romankiw, L. T.

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Electrodeposition of Indium on Copper for CIS and CIGS Solar Cell Applications von Huang, Q., Reuter, K., Amhed, S., Deligianni, L., Romankiw, L. T., Jaime, S., Grand, P.-P., Charrier, V.

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The influence of lithographic patterning on current distribution : a model for microfabrication by electrodeposition von MEHDIZADEH, S, DUKOVIC, J. O, ANDRICACOS, P. C, ROMANKIW, L. T, CHEH, H. Y

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Surface finishing of high speed print bands. II. An electrochemical process for microfinishing of hardened Fe-13Cr stainless steel von DATTA, M, ROMANKIW, L. T

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The influence of lithographic patterning on current distribution in electrodeposition : experimental study and mass-transfer effects von MEHDIZADEH, S, DUKOVIC, J, ANDRICACOS, P. C, ROMANKIW, L. T, CHEH, H. Y

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Investigation of island formation during through-mask electrochemical micromachining von SHENOY, R. V, DATTA, M, ROMANKIW, L. T

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Electrochemical fabrication of mechanically robust PbSn C4 interconnections von DATTA, M, SHENOY, R. V, AGARWALA, B, TONG, H. M, TOTTA, P, JAHNES, C, ANDRICACOS, P. C, HORKANS, J, DUKOVIC, J. O, ROMANKIW, L. T, ROEDER, J, DELIGIANNI, H, NYE, H

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A 2.5D Integrated Voltage Regulator Using Coupled-Magnetic-Core Inductors on Silicon Interposer von Sturcken, N., O'Sullivan, E. J., Wang, N., Herget, P., Webb, B. C., Romankiw, L. T., Petracca, M., Davies, R., Fontana, R. E., Decad, G. M., Kymissis, I., Peterchev, A. V., Carloni, L. P., Gallagher, W. J., Shepard, K. L.

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Jet and laser-jet electrochemical micromachining of nickel and steel von DATTA, M, ROMANKIW, L. T, VIGLIOTTI, D. R, VON GUTFELD, R. J

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Stripping voltammetry of nickel-iron films electrodeposited on platinum using a rotating ring-disk electrode von ANDRICACOS, P. C, TABIB, J, ROMANKIW, L. T

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Optimization of electrodeposit uniformity by the use of auxiliary electrodes von MEHDIZADEH, S, DUKOVIC, J, ANDRICACOS, P. C, ROMANKIW, L. T, CHEH, H. Y

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Corrosive inorganic contamination on wafer surfaces after nickel-iron electroplating Formation Mechanisms and Prevention von Kritzer, P., Diel, W., Barber, P. H., Romankiw, L. T.

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A TEM study of the effect of accelerators on Pd-Sn colloidal catalysts and on the initiation of electroless Cu deposition on epoxy von HORKANS, J, JUNGIHL KIM, MCGRATH, C, ROMANKIW, L. T

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Laser-enhanced electrodeposition of lead-tin solder von LIN, Q, SHEPPARD, K. G, DATTA, M, ROMANKIW, L. T

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The Next Frontier: Electrodeposition for Solar Cell Fabrication von Deligianni, H., Ahmed, S., Romankiw, L. T.

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Fourfold anisotropy of an electrodeposited Co/Cu compositionally modulated alloy von McMichael, R.D, Atzmony, U, Beauchamp, C, Bennett, L.H, Swartzendruber, L.J, Lashmore, D.S, Romankiw, L.T

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(Invited) Thin Film Magnetic Heads - Early Inventions and Their Ongoing Impact on Magnetic Storage and on Electrochemistry von Romankiw, Lubomyr T., Krongelb, Sol

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Electrochemical and metallurgical aspects of laser-enhanced jet plating of gold von GELCHINSKI, M. H, ROMANKIW, L. T, VIGLIOTTI, D. R, VON GUTFELD, R. J

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