Study of adhesive flip chip bonding process and failure mechanisms of ACA joints von Seppälä, A., Ristolainen, E.

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Flip chip attachment on flexible LCP substrate using an ACF von Frisk, L., Ristolainen, E.

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The effect of solder paste composition on the reliability of SnAgCu joints von Nurmi, S., Sundelin, J., Ristolainen, E., Lepistö, T.

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An improved model for ground-shielded CMOS test fixtures von Kaija, T., Ristolainen, E.O.

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Strength of Ta–Si interfaces by molecular dynamics von Heino, P., Ristolainen, E.

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An experimental study of scalability in shield-based on-wafer CMOS test fixtures von Kaija, T., Ristolainen, E.O.

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Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates von FRISK, L, SEPPÄLÄ, A, RISTOLAINEN, E

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The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs von Nurmi, S.T, Sundelin, J.J, Ristolainen, E.O, Lepistö, T

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Failure mechanisms of adhesive flip chip joints von Seppälä, A., Allinniemi, T., Ristolainen, E.

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COMPARISON OF THE CORROSION-RESISTANCE OF TIN AND (TI,AL)N COATINGS von PENTTINEN, IM, KORHONEN, AS, HARJU, E, TURKIA, MA, FORSEN, O, RISTOLAINEN, EO

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Novel Study of Influence of Gate Layout Geometries on RF Cascode nMOSFET Transit Frequency von Kaija, T, Marenk, M, Ristolainen, E O

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Mechanical and microstructural properties of SnAgCu solder joints von Sundelin, Janne J., Nurmi, Sami T., Lepistö, Toivo K., Ristolainen, Eero O.

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Mechanical properties of nanoscale copper under shear von Heino, P., Ristolainen, E.

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Improving the fatigue life of a bare die flip chip by thinning von Alander, T, Suominen, I, Heino, P, Ristolainen, E

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Impact of component placement in solder joint reliability von Alander, T, Nurmi, S, Heino, P, Ristolainen, E

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Strength of nanoscale copper under shear von Heino, P., Holloway, P., Ristolainen, E.

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Synthesis of thermal RC-networks for system-in-packages von Kyyhkynen, V., Valtanen, J., Ristolainen, E.

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Thermal conduction at the nanoscale in some metals by MD von Heino, P., Ristolainen, E.

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Stacking-fault energy of copper from molecular-dynamics simulations von Heino, P., Perondi, L., Kaski, K., Ristolainen, E.

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Analysis of Substrates for Single Emitter Laser Diodes von Alander, Tapani M, Heino, Pekka A, Ristolainen, Eero O

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