Theory and Practice of Thermal Transient Testing of Electronic Components von Rencz, Marta, Farkas, Gábor, Poppe, András

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High-aspect-ratio metal microchannel plates for microelectronic cooling applications von Yu, W, Desmulliez, M P Y, Drufke, A, Leonard, M, Dhariwal, R S, Flynn, D, Bognár, G, Poppe, A, Horvath, G, Kohari, Z, Rencz, M

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Thermal Measurement and Modeling of Multi-Die Packages von Poppe, A., Yan Zhang, Wilson, J., Farkas, G., Szabo, P., Parry, J., Rencz, M., Szekely, V.

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Thermal and Electro-thermal System Simulation 2020

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Thermal issues in stacked die packages von Rencz, M.

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Studies on the nonlinearity effects in dynamic compact model generation of packages von Rencz, M., Szekely, V.

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Structure function evaluation of stacked dies von Rencz, M., Szekely, V.

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Measuring partial thermal resistances in a heat-flow path von Rencz, M.R., Szekely, V.

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Heat-flux sensor to support transient thermal characterisation of IC packages von Rencz, M., Kollár, E., Székely, V.

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An efficient reliability testing method combined with thermal performance monitoring von Hantos, G., Hegedüs, J., Rencz, M.

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Contactless thermal characterization of high temperature test chamber von Bognár, György, Szűcs, Z., Székely, V., Rencz, M.

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Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities von Rencz, M., Szekely, V., Morelli, A., Villa, C.

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Dynamic thermal multiport modeling of IC packages von Rencz, M., Szekely, V.

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Electro-thermal and logi-thermal simulation of VLSI designs von Szekely, V., Poppe, A., Pahi, A., Csendes, A., Hajas, G., Rencz, M.

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A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards von Rencz, M., Szekely, V., Poppe, A.

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Thermal dynamics and the time constant domain von Szekely, V., Rencz, M.

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Increasing the accuracy of thermal transient measurements von Szekely, V., Rencz, M.

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Design of a Static TIM Tester von Székely, V, Kollár, E, Somlay, G, Szabó, P. G, Rencz, M

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Cross-Verification of Thermal Characterization of a Microcooler von Kohári, Zs, Bognár, Gy, Horváth, Gy, Poppe, A, Rencz, M, Székely, V

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Increasing the accuracy of structure function based thermal material parameter measurements von Rencz, M., Poppe, A., Kollar, E., Ress, S., Szekely, V.

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